SAK-XE164FM-24F80L AA Infineon Technologies, SAK-XE164FM-24F80L AA Datasheet - Page 122

• Manufacturer Part Number: SAK-XE164FM-24F80L AA
• Description: IC MCU 16BIT FLASH 100-LQFP
• Manufacturer: Infineon Technologies
• Series: XE16xr

Specifications of SAK-XE164FM-24F80L AA

• Core Processor: C166SV2
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: SP000628600

5
In addition to the electrical parameters, the following specifications ensure proper
integration of the XE164xM into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 38
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
Package Compatibility Considerations
The XE164xM is a member of the XE166 Family of microcontrollers. It is also compatible
to a certain extent with members of similar series and subfamilies.
Each package is optimized for the chip it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
exposed pad not soldered.
soldered.
to the board.
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-100-8)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
XE164FM, XE164GM, XE164HM, XE164KM
Min.
–
–
122
XE166 Family Derivatives / Base Line
Limit Values
Max.
6.2 × 6.2
1.0
47
29
23
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
–
V2.0, 2009-03
3)
1)
2)