PIC17C756-33I/SP Microchip Technology, PIC17C756-33I/SP Datasheet - Page 264
PIC17C756-33I/SP
Manufacturer Part Number
PIC17C756-33I/SP
Description
MICRO CTRL 16K MEMORY OTP 64SDIP
Manufacturer
Microchip Technology
Series
PIC® 17Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC17C752-16L.pdf
(304 pages)
3.PIC17C752-16L.pdf
(4 pages)
4.PIC17C752-16L.pdf
(6 pages)
5.PIC17C756CL.pdf
(321 pages)
Specifications of PIC17C756-33I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
33MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
50
Program Memory Size
32KB (16K x 16)
Program Memory Type
OTP
Ram Size
902 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-SDIP (0.750", 19.05mm)
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
Other names
PIC17C756-33I/P
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC17C756-33I/SP
Manufacturer:
OKI
Quantity:
6 270
- PIC16F616T-ISL PDF datasheet
- PIC17C752-16L PDF datasheet #2
- PIC17C752-16L PDF datasheet #3
- PIC17C752-16L PDF datasheet #4
- PIC17C756CL PDF datasheet #5
- Current page: 264 of 321
- Download datasheet (3Mb)
22.4
DS30264A-page 264
64-Lead SDIP (Shrink DIP)
64-Lead TQFP
68-Lead PLCC
68-Lead CERQUAD Windowed
MMMMMMMMMMMMMMMMM
MMMMMMMMMM
MMMMMMM
MMMMMMMMMM
MMMMMMM
AABBCDE
AABBCDE
Package Marking Information
*
AABBCDE
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
Legend:
AABBCDE
MMMMMMMMMMMMMMMMM
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
MM...M
XX...X
AA
BB
C
D 1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Example
Example
Example
Example
PIC17C756
-08/L
9748CAE
PIC17C752
-08I/PT
9717CAE
PIC17C756-04/CL
9750CAE
9736CAE
PIC17C752-04I/SP
1997 Microchip Technology Inc.
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