PIC16C924-08/SP Microchip Technology, PIC16C924-08/SP Datasheet - Page 174
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16C924-08/SP
Manufacturer Part Number
PIC16C924-08/SP
Description
IC MCU 64 LD 8MHZ 4K OTP 64-SDIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16C923-04L.pdf
(189 pages)
4.PIC16LC924-04L.pdf
(10 pages)
Specifications of PIC16C924-08/SP
Core Processor
PIC
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SPI
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
7KB (4K x 14)
Program Memory Type
OTP
Ram Size
176 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
64-SDIP (0.750", 19.05mm)
For Use With
AC164025 - MODULE SKT PROMATEII 64DIPDVA16XP640 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16C923-04L PDF datasheet #3
- PIC16LC924-04L PDF datasheet #4
- Current page: 174 of 189
- Download datasheet (2Mb)
PIC16C9XX
19.4
DS30444E - page 174
64-Lead SDIP (Shrink DIP)
64-Lead TQFP
68-Lead CERQUAD Windowed
68-Lead PLCC
MMMMMMMMMMMMMMMMM
MMMMMMMMMM
MMMMMMM
MMMMMMMMMM
MMMMMMM
AABBCDE
AABBCDE
Package Marking Information
*
AABBCDE
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
Legend:
AABBCDE
MMMMMMMMMMMMMMMMM
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
MM...M
XX...X
AA
BB
C
D 1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Example
Example
Example
Example
PIC16C924
-08/L
9648CAE
PIC16C923
-08I/PT
9712CAE
PIC16C924-04/CL
9650CAE
9736CAE
PIC16C924-04I/SP
1997 Microchip Technology Inc.
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