ATMEGA32-16MI Atmel, ATMEGA32-16MI Datasheet - Page 19
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ATMEGA32-16MI
Manufacturer Part Number
ATMEGA32-16MI
Description
IC AVR MCU 32K 16MHZ IND 44-QFN
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA32-16MI
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-VQFN Exposed Pad
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Changes from Rev.
2503D-02/03 to
Rev. 2503E-09/03
Changes from Rev.
2503C-10/02 to
Rev. 2503D-02/03
Changes from Rev.
2503B-10/02 to
Rev. 2503C-10/02
Changes from Rev.
2503A-03/02 to
Rev. 2503B-10/02
2503QS–AVR–02/11
1. Updated and changed “On-chip Debug System” to
2. Updated
3. Updated
4. Updated description for Bit 7 – JTD: JTAG Interface Disable on
5. Added a note regarding JTAGEN fuse to
6. Updated Absolute Maximum Ratings* , DC Characteristics and ADC Characteristics in
7. Added a proposal for solving problems regarding the JTAG instruction IDCODE in
1. Added EEAR9 in EEARH in
2. Added Chip Erase as a first step
3. Removed reference to “Multi-purpose Oscillator” application note and “32 kHz Crys-
4. Added information about PWM symmetry for Timer0 and Timer2.
5. Added note in
6. Added “Power Consumption” data in
7. Added section
8. Added note about Differential Mode with Auto Triggering in
9. Updated
10.Added updated
1. Updated the
1. Canged the endurance on the Flash to 10,000 Write/Erase Cycles.
2. Bit nr.4 – ADHSM – in SFIOR Register removed.
3. Added the section
4. When using External Clock there are some limitations regards to change of fre-
Debug System” on page
“Electrical Characteristics” on page
“Errata” on page
gramming the EEPROM” on page
tal Oscillator” application note, which do not exist.
ing to the EEPROM during an SPM Page Load.
sion Timing” on page
quency. This is described in
Table 15 on page
“Test Access Port – TAP” on page 219
Table 89 on page
“DC Characteristics” on page
“Filling the Temporary Buffer (Page Loading)” on page 251
“Packaging Information” on page
“EEPROM Write During Power-down Sleep Mode” on page
336.
“Default Clock Source” on page
204.
35.
37.
232.
“Register Summary” on page
“External Clock” on page 31
in“Programming the Flash” on page 284
285.
287.
“Features” on page
Table 104 on page
287.
regarding the JTAGEN fuse.
333.
25.
“JTAG Interface and On-chip
327.
and
1.
257.
“Prescaling and Conver-
ATmega32(L)
Table 117 on page
page
228.
22.
about writ-
and
“Pro-
289.
19