PIC16LF819T-E/ML Microchip Technology, PIC16LF819T-E/ML Datasheet - Page 7
![IC PIC MCU FLASH 2KX14 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16LF819T-E/ML
Manufacturer Part Number
PIC16LF819T-E/ML
Description
IC PIC MCU FLASH 2KX14 28QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16LF819T-E/ML
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
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Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer0 Module ......................................................................................................................................................................... 111
11.0 Timer1 Module ......................................................................................................................................................................... 115
12.0 Timer2 Module ......................................................................................................................................................................... 121
13.0 Capture/Compare/PWM (CCP) Module ................................................................................................................................... 123
14.0 Universal Serial Bus (USB) ...................................................................................................................................................... 129
15.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 153
16.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 175
17.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 185
18.0 Special Features of the CPU.................................................................................................................................................... 191
19.0 Instruction Set Summary .......................................................................................................................................................... 213
20.0 Development Support............................................................................................................................................................... 263
21.0 Electrical Characteristics .......................................................................................................................................................... 267
22.0 Packaging Information.............................................................................................................................................................. 295
Appendix A: Revision History............................................................................................................................................................. 307
Appendix B: Device Differences ........................................................................................................................................................ 308
Appendix C: Conversion Considerations ........................................................................................................................................... 309
Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 309
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 310
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 310
Index ................................................................................................................................................................................................. 311
The Microchip Web Site ..................................................................................................................................................................... 319
Customer Change Notification Service .............................................................................................................................................. 319
Customer Support .............................................................................................................................................................................. 319
Reader Response .............................................................................................................................................................................. 320
Product Identification System ............................................................................................................................................................ 321
© 2008 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 53
Flash Program Memory.............................................................................................................................................................. 73
8 x 8 Hardware Multiplier............................................................................................................................................................ 83
Interrupts .................................................................................................................................................................................... 85
I/O Ports ..................................................................................................................................................................................... 99
PIC18F2450/4450
DS39760D-page 5
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