AT89C51RB2-3CSIM Atmel, AT89C51RB2-3CSIM Datasheet - Page 91

IC 8051 MCU FLASH 16K 40DIP

AT89C51RB2-3CSIM

Manufacturer Part Number
AT89C51RB2-3CSIM
Description
IC 8051 MCU FLASH 16K 40DIP
Manufacturer
Atmel
Series
89Cr
Datasheet

Specifications of AT89C51RB2-3CSIM

Core Processor
8051
Core Size
8-Bit
Speed
60MHz
Connectivity
SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Data Bus Width
8 bit
Data Ram Size
1.25 KB
Interface Type
SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
For Use With
AT89STK-11 - KIT STARTER FOR AT89C51RX2
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT89C51RB2-3CSIM
Manufacturer:
ATMEL
Quantity:
982
Bootloader Architecture
Introduction
Acronyms
4180E–8051–10/06
Access via
Specific
Protocol
Access From
User
Application
The bootloader manages a communication according to a specific defined protocol to
provide the whole access and service on Flash memory. Furthermore, all accesses and
routines can be called from the user application.
Figure 36. Diagram Context Description
ISP: In-system Programming
SBV: Software Boot Vector
BSB: Boot Status Byte
SSB: Software Security Bit
HW : Hardware Byte
Bootloader
AT89C51RB2/RC2
Flash Memory
91

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