ATMEGA8L-8PJ Atmel, ATMEGA8L-8PJ Datasheet - Page 2
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ATMEGA8L-8PJ
Manufacturer Part Number
ATMEGA8L-8PJ
Description
IC MCU AVR 8K 5V 8MHZ 28-DIP
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA8L-8PJ
Core Processor
AVR
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Pin
Configurations
2486ZS–AVR–02/11
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XCK/T0) PD4
(XCK/T0) PD4
(INT1) PD3
(INT1) PD3
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
GND
GND
GND
GND
VCC
VCC
VCC
VCC
(XCK/T0) PD4
(RESET) PC6
(INT0) PD2
(INT1) PD3
(AIN0) PD6
(AIN1) PD7
(ICP1) PB0
(RXD) PD0
(TXD) PD1
(T1) PD5
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
GND
VCC
TQFP Top View
MLF Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PDIP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PC5 (ADC5/SCL)
PC4 (ADC4/SDA)
PC3 (ADC3)
PC2 (ADC2)
PC1 (ADC1)
PC0 (ADC0)
GND
AREF
AVCC
PB5 (SCK)
PB4 (MISO)
PB3 (MOSI/OC2)
PB2 (SS/OC1B)
PB1 (OC1A)
24
23
22
21
20
19
18
17
24
23
22
21
20
19
18
17
NOTE:
The large center pad underneath the MLF
packages is made of metal and internally
connected to GND. It should be soldered
or glued to the PCB to ensure good
mechanical stability. If the center pad is
left unconneted, the package might
loosen from the PCB.
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
ATmega8(L)
2