AT89C51ED2-RDRIM Atmel, AT89C51ED2-RDRIM Datasheet - Page 114

• Manufacturer Part Number: AT89C51ED2-RDRIM
• Description: IC MCU FLASH 8051 64K 5V 64-VQFP
• Manufacturer: Atmel
• Series: 89Cr

Specifications of AT89C51ED2-RDRIM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 60MHz
• Connectivity: SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Data Converters: -
• Other names: AT89C51ED2RDRIMTR

25.
25.1
25.2
T
V
V
114
A
I = industrial ........................................................-40 ° C to 85 ° C
Storage Temperature .................................... -65 ° C to + 150 ° C
Voltage on V
VVoltage on Any Pin to V
Power Dissipation ........................................................... 1 W
CC
CC
Symbol
= -40°C to +85°C; V
V
V
V
V
=2.7V to 5.5V and F = 0 to 40 MHz (both internal and external code execution)
=4.5V to 5.5V and F = 0 to 60 MHz (internal code execution only)
V
V
OL1
IH1
OH
OL
IL
IH
E
lectrical Characteristics
Absolute Maximum Ratings
DC Parameters for Standard Voltage
AT89C51RD2/ED2
Parameter
Input Low Voltage
Input High Voltage except RST, XTAL1
Input High Voltage RST, XTAL1
Output Low Voltage, ports 1, 2, 3, 4
Output Low Voltage, port 0, ALE, PSEN
Output High Voltage, ports 1, 2, 3, 4
CC
to V
SS
......................................-0.5V to + 6.5V
SS
SS
= 0V;
.......................-0.5V to V
(6)
(6)
CC
+ 0.5V
0.2 V
V
V
V
(2)
0.7 V
0.9 V
CC
CC
CC
Min
-0.5
CC
- 0.3
- 0.7
- 1.5
+ 0.9
CC
CC
Note:
Typ
Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional
operation of the device at these or any other condi-
tions above those indicated in the operational
sections of this specification is not implied. Exposure
to absolute maximum rating conditions may affect
device reliability.
Power dissipation is based on the maximum allow-
able die temperature and the thermal resistance of
the package.
0.2 V
V
V
CC
CC
Max
0.45
0.45
0.45
0.45
0.3
1.0
0.3
1.0
CC
+ 0.5
+ 0.5
- 0.1
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Test Conditions
V
I
I
I
V
I
V
I
I
I
V
I
V
I
I
I
V
I
OL
OL
OL
OL
OL
OL
OL
OL
OH
OH
OH
OH
CC
CC
CC
CC
CC
CC
= 100 µA
= 1.6 mA
= 3.5 mA
= 0.8 mA
= 200 µA
= 3.2 mA
= 7.0 mA
= 1.6 mA
4235K–8051–05/08
= -10 µA
= -30 µA
= -60 µA
= -10 µA
= 4.5V to 5.5V
= 2.7V to 5.5V
= 4.5V to 5.5V
= 2.7V to 5.5V
= 5V ± 10%
= 2.7V to 5.5V
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)