AT91SAM9261SB-CU Atmel, AT91SAM9261SB-CU Datasheet - Page 9
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AT91SAM9261SB-CU
Manufacturer Part Number
AT91SAM9261SB-CU
Description
IC ARM9 MPU 217-LFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet
1.AT91SAM9261SB-CU.pdf
(39 pages)
Specifications of AT91SAM9261SB-CU
Core Processor
ARM9
Core Size
16/32-Bit
Speed
190MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
DMA, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
217-LFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
2-Wire, I2S, SPI, USB
Maximum Clock Frequency
190 MHz
Number Of Programmable I/os
96
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9261-EK
Minimum Operating Temperature
- 40 C
For Use With
AT91SAM9261-EK - KIT EVAL FOR AT91SAM926EJ-SAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT91SAM9261SB-CU-EOL
Manufacturer:
Atmel
Quantity:
56
4. Package and Pinout
4.1
6242ES–ATARM–11-Sep-09
217-ball LFBGA Package Outline
The AT91SAM9261S is available in a 217-ball LFBGA RoHS-compliant package, 15 x 15 mm,
0.8 mm ball pitch
Figure 4-1
A detailed mechanical description is given in the section “AT91SAM9261S Mechanical Charac-
teristics” of the product datasheet.
Figure 4-1.
shows the orientation of the 217-ball LFBGA Package.
217-ball LFBGA Package Outline (Top View)
Ball A1
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A B C D E F G H J K L M N P R T U
AT91SAM9261S
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