MC68HC908JB12DW Freescale Semiconductor, MC68HC908JB12DW Datasheet - Page 326

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MC68HC908JB12DW

Manufacturer Part Number
MC68HC908JB12DW
Description
IC MCU 12K FLASH 6MHZ USB 28SOIC
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheets

Specifications of MC68HC908JB12DW

Core Processor
HC08
Core Size
8-Bit
Speed
6MHz
Connectivity
SCI, USB
Peripherals
LED, LVD, POR, PWM
Number Of I /o
21
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC908JB12DW
Manufacturer:
FREESCALE
Quantity:
20 000
Mechanical Specifications
21.3 32-Pin Low-Profile Quad Flat Pack (LQFP)
Technical Data
326
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
Figure 21-1. 32-Pin LQFP (Case #873A)
X
–Z–
25
K
R
4X
4X
17
Q
Mechanical Specifications
0.20 (0.008)
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É
É É
É É
É É
T–U
METAL
BASE
Z
N
J
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
MC68HC908JB16
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
DETAIL Y
1
12 REF
Freescale Semiconductor
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
12 REF
1
INCHES
AE
AE
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
MAX
0.010
5
Rev. 1.1

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