HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 206

IC H8S MCU FLASH 512K 100-QFP

HD64F2319VTE25

Manufacturer Part Number
HD64F2319VTE25
Description
IC H8S MCU FLASH 512K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2319VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2319VTE25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
Full access
Burst access
T
T
T
T
1
2
1
1
φ
Only lower address changed
Address bus
CS0
AS
RD
Data bus
Read data
Read data Read data
Figure 6.15 (b) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0)
6.5.3
Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) of the burst ROM interface. See section 6.4.5, Wait
Control.
Wait states cannot be inserted in a burst cycle.
Rev.7.00 Feb. 14, 2007 page 172 of 1108
REJ09B0089-0700

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