M30262F8GP#D9 Renesas Electronics America, M30262F8GP#D9 Datasheet - Page 39

IC M16C MCU FLASH 64K 48LQFP

M30262F8GP#D9

Manufacturer Part Number
M30262F8GP#D9
Description
IC M16C MCU FLASH 64K 48LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/Tiny/26r
Datasheet

Specifications of M30262F8GP#D9

Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M30262F8GP#D9M30262F8GP
Manufacturer:
NA
Quantity:
20 000
Company:
Part Number:
M30262F8GP#D9M30262F8GP#D3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30262F8GP#D9M30262F8GP#D5
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30262F8GP#D9M30262F8GP#U3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30262F8GP#D9M30262F8GP#U5
Manufacturer:
Renesas Electronics America
Quantity:
10 000
M16C/26 Group
Rev.1.00
REJ09B0176-0100Z
48P6Q-A
6. Package
EIAJ Package Code
LQFP48-P-77-0.50
12
1
13
48
2004.6.10
b
H
e
D
D
x
Recommended
page 37 of 37
M
37
24
y
JEDEC Code
36
25
F
Weight(g)
Detail F
A
Lead Material
Cu Alloy
L
1
Lp
L
Plastic 48pin 7 7mm body LQFP
Symbol
H
M
M
H
A
A
Lp
L
A3
b
A
D
E
I
b
c
e
L
y
x
I
2
1
2
D
E
1
2
D
E
2
Recommended Mount Pad
Dimension in Millimeters
Min
8.8
8.8
0.35
0.45
0
0.17
0.105
6.9
6.9
1.0
0
M
D
Nom
0.125
0.1
1.4
0.22
7.0
7.0
0.5
9.0
9.0
0.5
1.0
0.6
0.25
0.225
7.4
7.4
6. Package
Max
0.27
0.175
7.1
9.2
0.1
1.7
0.2
7.1
9.2
0.65
0.75
0.08
8

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