M30262F8GP#U5 Renesas Electronics America, M30262F8GP#U5 Datasheet - Page 6
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M30262F8GP#U5
Manufacturer Part Number
M30262F8GP#U5
Description
IC M16C/TINY MCU FLASH 48LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/Tiny/26r
Datasheets
1.M30622SAFPU5.pdf
(308 pages)
2.M30262F4GPU3.pdf
(41 pages)
3.M30262F4GPU3.pdf
(241 pages)
Specifications of M30262F8GP#U5
Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M30262F8GP#U5M30262F8GP#D3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
M30262F8GP#U5M30262F8GP#D5
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
M30262F8GP#U5M30262F8GP#U3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
M16C/26 Group
Rev.1.00
REJ09B0176-0100Z
1.4 Product List
Table 1.2. Product List
Figure 1.2. Type No., Memory Size, and Package
M30262F3GP
M30262F4GP
M30262F6GP
M30262F8GP
Table 1.2 lists the M16C/26 group products, Figure 1.2 shows the type numbers, memory sizes and pack-
ages, Table 1.3 lists the product code, and Figure 1.3 shows the marking.
Type No.
Type No.
2004.6.10
page 4 of 37
M 3 0 2 6 2 F 4 GP – D3
ROM capacity
24K + 4K byte
32K + 4K byte
48K + 4K byte
64K + 4K byte
RAM capacity
1K byte
1K byte
2K byte
2K byte
Product code:
Memory type:
M16C/26 Group
M16C Family
Package type:
ROM capacity:
Shows RAM capacity, pin count, etc
(The value itself has no specific meaning)
3: (24K + 4K) bytes
4: (32K + 4K) bytes
6: (48K + 4K) bytes
8: (64K + 4K) bytes
Refer to Table 1.3
F: Flash memory version
GP : Package
Package type
48P6Q-A
48P6Q-A
Flash ROM Version
Remarks
As of May 2004
1. Overview