HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 698

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix A Instruction Set
Table A.3
Legend:
m: Number of wait states inserted into external device access
Rev. 2.00 Sep 20, 2005 page 658 of 800
REJ09B0260-0200
Instruction fetch
Branch address read S
Stack operation
Byte data access
Word data access
Internal operation
Cycle
Number of States per Cycle
S
S
S
S
S
I
J
K
L
M
N
On-Chip
Memory 8-Bit Bus 16-Bit
2
porting Module
On-Chip Sup-
6
3
6
Bus
Access Conditions
3
Access
2-State
1
4
2
4
8-Bit Bus
Access
3-State
External Device
6 + 2m
6 + 2m
3 + m
Access
2-State
16-Bit Bus
2
Access
3-State
3 + m