MC9S08DZ32MLF Freescale Semiconductor, MC9S08DZ32MLF Datasheet - Page 139

IC MCU 32K FLASH 2K RAM 48-LQFP

MC9S08DZ32MLF

Manufacturer Part Number
MC9S08DZ32MLF
Description
IC MCU 32K FLASH 2K RAM 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08DZ32MLF

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
For Use With
EVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08DZ32MLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MC9S08DZ32MLF
Quantity:
389
8.1.2
There are nine modes of operation for the MCG:
For details see
8.2
There are no MCG signals that connect off chip.
Freescale Semiconductor
FLL Engaged Internal (FEI)
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed External (FBE)
PLL Engaged External (PEE)
PLL Bypassed External (PBE)
Bypassed Low Power Internal (BLPI)
Bypassed Low Power External (BLPE)
Stop
External Signal Description
Modes of Operation
Section 8.4.1, “Operational
MC9S08DZ60 Series Data Sheet, Rev. 4
Modes.
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
139

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