MCF54452CVR200 Freescale Semiconductor, MCF54452CVR200 Datasheet - Page 22
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MCF54452CVR200
Manufacturer Part Number
MCF54452CVR200
Description
IC MPU 32BIT 200MHZ 360TEPBGA
Manufacturer
Freescale Semiconductor
Series
MCF5445xr
Datasheet
1.MCF54452CVR200.pdf
(48 pages)
Specifications of MCF54452CVR200
Core Processor
Coldfire V4
Core Size
32-Bit
Speed
200MHz
Connectivity
I²C, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, WDT
Number Of I /o
132
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.35 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
360-TEPBGA
Processor Series
MCF544x
Core
ColdFire V4
Data Bus Width
32 bit
Program Memory Size
16 KB
Data Ram Size
32 KB
Interface Type
I2C, SPI, SSI
Maximum Clock Frequency
66 MHz
Number Of Timers
8
Operating Supply Voltage
- 0.3 V to + 4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M54455EVB
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit, 16 Channel
On-chip Dac
16 bit, 16 Channel
Family Name
MCF5445X
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
200MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
1.65/3.6V
Operating Supply Voltage (min)
1.35/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
360
Package Type
TEBGA
For Use With
M54455EVB - BOARD EVAL FOR MCF5445X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF54452CVR200
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MCF54452CVR200
Manufacturer:
FREESCAL
Quantity:
160
Electrical Characteristics
5.6
Table 11
22
1
2
3
4
5
6
7
Num
1
2
The minimum system frequency is the minimum input clock divided by the maximum low-power divider (16 MHz ÷ 32,768).
When the PLL is enabled, the minimum system frequency (f
reference only.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the PLL circuitry via PLL V
percentage for a given interval.
This parameter is guaranteed by characterization before qualification rather than 100% tested. Applies to external clock
Proper PC board layout procedures must be followed to achieve specifications.
This parameter is guaranteed by design rather than 100% tested.
This specification is the PLL lock time only and does not include oscillator start-up time.
C
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f
12
13
14
15
17
Num
R1
S_PCB
RESET and Configuration Override data lines are synchronized internally. Setup and hold times must be met only if
recognition on a particular clock is required.
During low power STOP, the synchronizers for the RESET input are bypassed and RESET is asserted asynchronously
to the system. Thus, RESET must be held a minimum of 100 ns.
R2
R3
R4
R5
R6
R7
R8
1
lists specifications for the reset timing parameters shown in
Crystal capacitive load
Discrete load capacitance for XTAL
Discrete load capacitance for EXTAL
Frequency un-LOCK Range
Frequency LOCK Range
CLKOUT Period Jitter,
Reset Timing Specifications
RESET valid to CLKIN (setup)
CLKIN to RESET invalid (hold)
RESET valid time
CLKIN to RSTOUT valid
RSTOUT valid to Configuration Override inputs valid
Configuration Override inputs valid to RSTOUT invalid (setup)
Configuration Override inputs invalid after RSTOUT invalid (hold)
RSTOUT invalid to Configuration Override inputs High Impedance
is the measured PCB stray capacitance on EXTAL and XTAL.
Peak-to-peak Jitter (Clock edge to clock edge)
Long Term Jitter
2
Characteristic
Table 10. PLL Electrical Characteristics (continued)
3, 4, 7
Table 11. Reset and Configuration Override Timing
MCF5445x ColdFire
Measured at f
Characteristic
DD
, EV
DD
, and V
SYS
®
Microprocessor Data Sheet, Rev. 6
Max
SS
and variation in crystal oscillator frequency increase the Cjitter
sys
) is 150 MHz.
Figure
C
Symbol
C
L_EXTAL
C
L_XTAL
f
f
C
LCK
jitter
UL
L
8.
Min
1.5
Value
20
—
—
Min.
9
5
0
0
-4.0
-2.0
See crystal spec
—
—
—
C
C
C
2 × (C
Max
S_EXTAL
S_XTAL
10
Value
S_PCB
—
—
—
—
—
—
Freescale Semiconductor
Max.
1
TBD
4.0
2.0
10
L
)
-
6
-
-
CLKIN cycles
CLKIN cycles
CLKIN cycles
% FB_CLK
% FB_CLK
Unit
ns
ns
ns
ns
ns
% f
% f
Unit
pF
sys
sys
sys
.