MCP6034-E/SL Microchip Technology, MCP6034-E/SL Datasheet - Page 23

• Manufacturer Part Number: MCP6034-E/SL
• Description: IC OPAMP QUAD 1.8V 14SOIC
• Manufacturer: Microchip Technology

Specifications of MCP6034-E/SL

• Slew Rate: 0.004 V/µs
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 10kHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 150µV
• Current - Supply: 0.9µA
• Current - Output / Channel: 23mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 4
• Common Mode Rejection Ratio (min): 70 dB
• Input Offset Voltage: 0.15 mV
• Input Bias Current (max): 100 pA
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 0.0054 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Technology: CMOS
• Voltage Gain Db: 115 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
N
D
A
E
α
e
h
L
φ
c
b
β
A2
E
0.10
0.40
0.31
MIN
1.25
0.25
0.17
φ
0°
5°
5°
–
L
MILLIMETERS
h
8.65 BSC
1.27 BSC
6.00 BSC
3.90 BSC
1.04 REF
L1
NOM
MCP6031/2/3/4
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
MAX
β
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
DS22041A-page 23
α
c