MCP6034-E/SL Microchip Technology, MCP6034-E/SL Datasheet - Page 24

• Manufacturer Part Number: MCP6034-E/SL
• Description: IC OPAMP QUAD 1.8V 14SOIC
• Manufacturer: Microchip Technology

Specifications of MCP6034-E/SL

• Slew Rate: 0.004 V/µs
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 10kHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 150µV
• Current - Supply: 0.9µA
• Current - Output / Channel: 23mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 4
• Common Mode Rejection Ratio (min): 70 dB
• Input Offset Voltage: 0.15 mV
• Input Bias Current (max): 100 pA
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 0.0054 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Technology: CMOS
• Voltage Gain Db: 115 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP6031/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS22041A-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
E1
e
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
0°
–
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
φ
L