SSM2018PZ Analog Devices Inc, SSM2018PZ Datasheet - Page 3

• Manufacturer Part Number: SSM2018PZ
• Description: IC AMP AUDIO MONO CLASS AB 16DIP
• Manufacturer: Analog Devices Inc

Specifications of SSM2018PZ

• Amplifier Type: Audio
• Number Of Circuits: 1
• Slew Rate: 5 V/µs
• Gain Bandwidth Product: 14MHz
• Current - Input Bias: 250nA
• Voltage - Input Offset: 1000µV
• Current - Supply: 11mA
• Voltage - Supply, Single/dual (±): 10 V ~ 36 V, ±5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Amplifier Class: AB
• No. Of Channels: 1
• Supply Voltage Range: ± 5V To ± 18V
• Load Impedance: 100kohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: DIP
• No. Of Pins: 16
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Current - Output / Channel: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

REV. B
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V
Operating Temperature Range . . . . . . . . . . . . –40∞C to +85∞C
Storage Temperature . . . . . . . . . . . . . . . . . . . –65∞C to +150∞C
Junction Temperature (T
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300∞C
THERMAL CHARACTERISTICS
Thermal Resistance
16-Lead Plastic DIP
16-Lead SOIC
TRANSISTOR COUNT
Number of Transistors
ESD RATINGS
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . . 500 V
EIAJ Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 V
NOTES
1
2
Model
SSM2018TP
SSM2018TS
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SSM2018T features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precau-
tions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
N = Plastic DIP; R = SOL.
Not for new designs; obsolete April 2002.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operation
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
P-DIP and device soldered in circuit board for SOIC package.
JA
Dual Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
SSM2018T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
is specified for worst-case conditions, i.e.;
JC
JC
JA
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76∞C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33∞C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92∞C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27∞C/W
2
Temperature Range
–40∞C to +85∞C
–40∞C to +85∞C
2
ORDERING GUIDE
J
) . . . . . . . . . . . . . . . . . . . . . . 150∞C
JA
1
is specified for device in socket for
Package Option
N-16
R-16
1
S
–3–
V
V
IN+
IN–
1 F 18k
1 F
18k
V+
SSM2018T Typical Application Circuit
47pF
COMP 1
COMP 2
+I
–I
PIN CONFIGURATION
1–G
1–G
+IN
–IN
–I
V+
16-Lead Plastic DIP
G
SSM2018T
SSM2018T
50pF
(Not to Scale)
18k
and SOL
TOP VIEW
WARNING!
1 F
V
BAL
V
GND
MODE
V
V–
COMP 3
150k
1–G
G
C
V
SSM2018T
V–
ESD SENSITIVE DEVICE
OUT
V+
1k
3k
V
CONTROL