TL084CN STMicroelectronics, TL084CN Datasheet - Page 13

IC AMP J-FET QUAD OP 14 DIP

TL084CN

Manufacturer Part Number
TL084CN
Description
IC AMP J-FET QUAD OP 14 DIP
Manufacturer
STMicroelectronics
Datasheets

Specifications of TL084CN

Amplifier Type
J-FET
Number Of Circuits
4
Slew Rate
16 V/µs
Gain Bandwidth Product
4MHz
Current - Input Bias
20pA
Voltage - Input Offset
3000µV
Current - Supply
1.4mA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
6 V ~ 36 V, ±3 V ~ 18 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Number Of Channels
4
Common Mode Rejection Ratio (min)
70 dB
Input Offset Voltage
10 mV
Input Bias Current (max)
200 pA
Supply Current
2.5 mA
Maximum Power Dissipation
680 mW
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Dual Supply Voltage
+/- 5 V, +/- 9 V, +/- 12 V, +/- 15 V
Maximum Dual Supply Voltage
+/- 18 V
Minimum Dual Supply Voltage
+/- 3 V
Mounting Style
Through Hole
Shutdown
No
Technology
BiFET
Voltage Gain Db
106.02 dB
Bandwidth
4 MHz
Channel Separation
120
Common Mode Rejection Ratio
86
Current, Input Bias
30 pA
Current, Input Offset
5 pA
Current, Output
20 mA
Current, Supply
1.4 mA
Harmonic Distortion
0.01 %
Number Of Amplifiers
Quad
Package Type
DIP-14
Power Dissipation
680 mW
Resistance, Input
10^12 Ohms
Signal Gain
200 V/mV
Temperature, Operating, Range
0 to +70 °C
Time, Rise
0.1 μs
Voltage, Input
±15 V
Voltage, Noise
15 nV/sqrt Hz
Voltage, Offset
3 mV
Voltage, Supply
6 to 36 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-2218-5

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TL084
6
6.1
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
TSSOP14 package information
Figure 25. TSSOP14 package mechanical drawing
Figure 26. TSSOP14 package mechanical data
Ref.
A1
A2
E1
L1
PIN 1 IDENTIFICATION
A
D
E
K
b
e
c
A
A2
Min.
0.05
0.19
0.09
0.45
0.8
4.9
6.2
4.3
A1
1
b
Millimeters
0.65 BSC
Typ.
0.60
6.4
4.4
1
5
D
e
Max.
0.15
0.30
0.20
0.75
1.05
4.48
1.2
5.1
6.6
c
E1
0.002
0.031
0.007
0.004
0.193
0.244
0.169
0.018
Min.
K
0.0256 BSC
L
Inches
Package information
0.004
0.039
0.197
0.252
0.173
0.024
Typ.
E
0.0089
0.047
0.006
0.041
0.012
0.201
0.260
0.176
0.030
Max.
13/18

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