LMC6484AIN/NOPB National Semiconductor, LMC6484AIN/NOPB Datasheet - Page 13

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LMC6484AIN/NOPB

Manufacturer Part Number
LMC6484AIN/NOPB
Description
IC OP AMP QUAD CMOS R-R 14-DIP
Manufacturer
National Semiconductor
Datasheets

Specifications of LMC6484AIN/NOPB

Amplifier Type
General Purpose
Number Of Circuits
4
Output Type
Rail-to-Rail
Slew Rate
1.3 V/µs
Gain Bandwidth Product
1.5MHz
Current - Input Bias
0.02pA
Voltage - Input Offset
110µV
Current - Supply
2.6mA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
3 V ~ 15.5 V, ±1.5 V ~ 7.75 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Bandwidth
1.5 MHz
Channel Separation
150
Common Mode Rejection Ratio
82
Current, Input Bias
0.02 pA
Current, Input Offset
0.01 pA
Current, Output
30 mA
Current, Supply
2 mA
Harmonic Distortion
0.01 %
Impedance, Thermal
70 °C/W
Number Of Amplifiers
Quad
Package Type
MDIP-14
Resistance, Input
10 Teraohms
Temperature, Operating, Range
-40 to +85 °C
Voltage, Gain
666 V/mV
Voltage, Input
3 to 15.5 V
Voltage, Noise
37 nV/sqrt Hz
Voltage, Offset
0.11 mV
Voltage, Output, High
14.7 V
Voltage, Output, Low
0.16 V
Voltage, Supply
5 V
Number Of Channels
4
Voltage Gain Db
116.47 dB
Common Mode Rejection Ratio (min)
70 dB
Input Offset Voltage
0.75 mV at 5 V
Operating Supply Voltage
5 V, 9 V, 12 V, 15 V
Supply Current
2.8 mA at 5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device
Other names
*LMC6484AIN
*LMC6484AIN/NOPB
LMC6484AIN
Application Information
of the ultra-low input current of the LMC6484, typically less
than 20 fA, it is essential to have an excellent layout. Fortu-
nately, the techniques of obtaining low leakages are quite
simple. First, the user must not ignore the surface leakage of
the PC board, even though it may sometimes appear accept-
ably low, because under conditions of high humidity or dust
or contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6484’s inputs and the
terminals of capacitors, diodes, conductors, resistors, relay
terminals, etc. connected to the op-amp’s inputs, as in Fig-
ure 9 . To have a significant effect, guard rings should be
placed in both the top and bottom of the PC board. This PC
foil must then be connected to a voltage which is at the same
voltage as the amplifier inputs, since no leakage current can
flow between two points at the same potential. For example,
a PC board trace-to-pad resistance of 10
mally considered a very large resistance, could leak 5 pA if
the trace were a 5V bus adjacent to the pad of the input. This
would cause a 250 times degradation from the LMC6484’s
actual performance. However, if a guard ring is held within 5
mV of the inputs, then even a resistance of 10
cause only 0.05 pA of leakage current. See Figure 10 for
typical connections of guard rings for standard op-amp
configurations.
FIGURE 9. Example of Guard Ring in P.C. Board
Layout
(Continued)
12
, which is nor-
11
DS011714-20
would
13
The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an in-
sulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board con-
struction, but the advantages are sometimes well worth the
effort
See Figure 11 .
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board.)
FIGURE 10. Typical Connections of Guard Rings
of
using
Non-Inverting Amplifier
FIGURE 11. Air Wiring
Inverting Amplifier
point-to-point
Follower
up-in-the-air
DS011714-23
DS011714-21
www.national.com
DS011714-22
DS011714-24
wiring.

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