LMH6704MAX/NOPB National Semiconductor, LMH6704MAX/NOPB Datasheet - Page 10

• Manufacturer Part Number: LMH6704MAX/NOPB
• Description: IC BUFFER PROG GAIN 650MHZ 8SOIC
• Manufacturer: National Semiconductor
• Series: LMH®r

Specifications of LMH6704MAX/NOPB

• Amplifier Type: Buffer
• Number Of Circuits: 1
• Slew Rate: 3000 V/µs
• -3db Bandwidth: 650MHz
• Current - Input Bias: 5µA
• Voltage - Input Offset: 2000µV
• Current - Supply: 11.5mA
• Current - Output / Channel: 90mA
• Voltage - Supply, Single/dual (±): 8 V ~ 12 V, ±4 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• For Use With: LMH730227 - BOARD EVALUATION FOR SOIC PKGLMH730165 - BOARD EVALUATIONLMH730216 - BOARD EVAL HS MONO AMP SOT23
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Other names: LMH6704MAX

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Application Information
P
ture (˚C) and θ
ambient, for a given package (˚C/W). For the SOT23-6 pack-
age θ
ESD PROTECTION
The LMH6704 is protected against electrostatic discharge
(ESD) on all pins. The LMH6704 will survive 2000V Human
Body model and 200V Machine model events. Input and
Output pins have ESD diodes to either supply pin (V
MAX
JA
= (150˚ – T
is 187˚C/W.
JA
AMB
= Thermal resistance, from junction to
)/ θ
JA
, where T
AMB
= Ambient tempera-
(Continued)
+
and
10
V
under most normal operating conditions. There are occa-
sions, however, when the ESD diodes will be evident. If the
LMH6704 is driven by a large signal while the device is
powered down, the ESD diodes might enter forward operat-
ing region and conduct. The current that flows through the
ESD diodes will either exit the chip through the supply pins
or will flow through the device, hence it is possible to inad-
vertently power up the LMH6704 with a large signal applied
to the input pins. Shorting the power pins to each other will
prevent the chip from being powered up through the input.
−
) which are reverse biased and essentially have no effect