EL5227CL Intersil, EL5227CL Datasheet - Page 16

• Manufacturer Part Number: EL5227CL
• Description: IC BUFFER LP OCT 2.5MHZ 24-QFN
• Manufacturer: Intersil

Specifications of EL5227CL

• Amplifier Type: Buffer
• Number Of Circuits: 8
• Output Type: Rail-to-Rail
• Slew Rate: 2.2 V/µs
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 2nA
• Voltage - Input Offset: 1000µV
• Current - Supply: 1.3mA
• Current - Output / Channel: 120mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Gain Bandwidth Product: -

Thin Shrink Small Outline Package Family (TSSOP)
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
N
1
C A B
A1
SEE DETAIL “X”
TOP VIEW
b
DETAIL X
SIDE VIEW
D
END VIEW
16
L1
(N/2)+1
L
(N/2)
0.10
M
0° - 8°
0.05
PIN #1 I.D.
EL5127, EL5227, EL5327, EL5427
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
14 LD 16 LD 20 LD 24 LD 28 LD
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
MILLIMETERS
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
TOLERANCE
+0.05/-0.06
+0.05/-0.06
Reference
Rev. F 2/07
±0.05
±0.05
±0.10
±0.10
±0.15
Basic
Basic
Max
May 4, 2007
FN7111.4