MAX708SESA-TG ON Semiconductor, MAX708SESA-TG Datasheet - Page 10

• Manufacturer Part Number: MAX708SESA-TG
• Description: IC MPU SUPERVISORY 2.93V 8SOIC
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MAX708SESA-TG

• Number Of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High/Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 2.93V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Elements: 1
• Monitored Voltage 1 (typ): 1 to 5.5V
• Threshold Voltage 1 (max): 2.97V
• Battery Backup Switching: No
• Watchdog Timer: No
• Chip Enable Signals: No
• Reset Active Time: 330ms
• Manual Reset: Yes
• Package Type: SOIC N
• Operating Supply Voltage (min): 1V
• Operating Supply Voltage (max): 5.5V
• Reset Threshold Voltage (max): 2.97V
• Reset Threshold Voltage (min): 2.89V
• Family Name: MAX708
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Power Fail Detection: Yes
• Mounting: Surface Mount
• Pin Count: 8
• Supply Current: 0.016mA
• Monitored Voltage: 1 V to 5.5 V
• Undervoltage Threshold: 2.93 V
• Overvoltage Threshold: 2.97 V
• Watchdog: No
• Power-up Reset Delay (typ): 200 ms
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 16 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Internal Hysteresis: Yes
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Output Type: Push-Pull
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MAX708SESA-TGOS; MAX708SESA-TGOS; MAX708SESA-TGOSTR

PUBLICATION ORDERING INFORMATION
Micro8 is a trademark of International Rectifier.
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [e-mail]
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
5
4
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
7.0
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
M
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
MAX707, MAX708
Y
http://onsemi.com
M
N
CASE 751−07
X 45
ISSUE AG
SOIC−8
_
M
10
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX707/D
MAX
8
_