MAX708SESA-TG ON Semiconductor, MAX708SESA-TG Datasheet - Page 9

• Manufacturer Part Number: MAX708SESA-TG
• Description: IC MPU SUPERVISORY 2.93V 8SOIC
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MAX708SESA-TG

• Number Of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High/Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 2.93V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Elements: 1
• Monitored Voltage 1 (typ): 1 to 5.5V
• Threshold Voltage 1 (max): 2.97V
• Battery Backup Switching: No
• Watchdog Timer: No
• Chip Enable Signals: No
• Reset Active Time: 330ms
• Manual Reset: Yes
• Package Type: SOIC N
• Operating Supply Voltage (min): 1V
• Operating Supply Voltage (max): 5.5V
• Reset Threshold Voltage (max): 2.97V
• Reset Threshold Voltage (min): 2.89V
• Family Name: MAX708
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Power Fail Detection: Yes
• Mounting: Surface Mount
• Pin Count: 8
• Supply Current: 0.016mA
• Monitored Voltage: 1 V to 5.5 V
• Undervoltage Threshold: 2.93 V
• Overvoltage Threshold: 2.97 V
• Watchdog: No
• Power-up Reset Delay (typ): 200 ms
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 16 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Internal Hysteresis: Yes
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Output Type: Push-Pull
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MAX708SESA-TGOS; MAX708SESA-TGOS; MAX708SESA-TGOSTR

−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
K
G
−A−
*For additional information on our Pb−Free strategy and soldering
H
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
D
−B−
8X
8 PL
0.041
0.08 (0.003)
1.04
6X
0.0256
0.126
0.65
J
3.20
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
MAX707, MAX708
M
http://onsemi.com
CASE 846A−02
T
B
ISSUE F
Micro8
S
9
0.015
A
0.38
L
S
8X
0.167
SCALE 8:1
4.24
0.208
5.28
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
DIM
A
B
C
D
G
H
K
J
L
MILLIMETERS
MIN
2.90
2.90
0.25
0.05
0.13
4.75
0.40
−−−
0.65 BSC
MAX
3.10
3.10
1.10
0.40
0.15
0.23
5.05
0.70
0.010
0.002
0.005
0.187
0.016
0.114
0.114
MIN
−−−
0.026 BSC
INCHES
0.122
0.122
0.043
0.016
0.006
0.009
0.199
0.028
MAX