MCP1700T-1202E/TT Microchip Technology, MCP1700T-1202E/TT Datasheet - Page 16

• Manufacturer Part Number: MCP1700T-1202E/TT
• Description: IC REG LDO 250MA 1.2V SOT23-3
• Manufacturer: Microchip Technology
• Type: Linearr

Specifications of MCP1700T-1202E/TT

• Regulator Topology: Positive Fixed
• Voltage - Output: 1.2V
• Voltage - Input: 2.3 ~ 6 V
• Voltage - Dropout (typical): 0.15V @ 250mA
• Number Of Regulators: 1
• Current - Output: 200mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Primary Input Voltage: 6V
• Output Voltage Fixed: 1.2V
• Dropout Voltage Vdo: 150mV
• No. Of Pins: 3
• Output Current: 200mA
• Operating Temperature Range: -40°C To +125°C
• Peak Reflow Compatible (260 C): Yes
• Package: 3SOT-23
• Function: LDO
• Number Of Outputs: 1
• Input Voltage Range: 6 to 2.3 V
• Output Voltage: 1.2 V
• Maximum Output Current: 0.2(Min) A
• Output Type: Fixed
• Accuracy: ±2 %
• Typical Dropout Voltage @ Current: 0.15@200mA V
• Polarity: Positive
• Input Voltage Max: 6 V
• Dropout Voltage (max): 350 mV
• Line Regulation: 0.75 % / V
• Load Regulation: 1 %
• Voltage Regulation Accuracy: 3 %
• Maximum Power Dissipation: 0.3696 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP1700T-1202E/TT; MCP1700T-1202E/TTTR

MCP1700
DS21826B-page 16
3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A1
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Lead Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
1
e
N
e1
b
D
2
Dimension Limits
E1
A2
E
Units
A2
A1
E1
e1
N
A
E
D
e
L
φ
c
b
c
0.89
0.79
0.01
2.10
1.16
2.67
0.13
0.08
0.30
MIN
0°
MILLIMETERS
0.95 BSC
1.90 BSC
NOM
0.95
1.30
2.90
0.50
Microchip Technology Drawing C04-104B
3
–
–
–
–
–
–
© 2007 Microchip Technology Inc.
MAX
1.12
0.10
0.60
0.54
1.02
2.64
1.40
3.05
0.20
10°
L
φ