MCP1700T-1202E/TT Microchip Technology, MCP1700T-1202E/TT Datasheet - Page 17

• Manufacturer Part Number: MCP1700T-1202E/TT
• Description: IC REG LDO 250MA 1.2V SOT23-3
• Manufacturer: Microchip Technology
• Type: Linearr

Specifications of MCP1700T-1202E/TT

• Regulator Topology: Positive Fixed
• Voltage - Output: 1.2V
• Voltage - Input: 2.3 ~ 6 V
• Voltage - Dropout (typical): 0.15V @ 250mA
• Number Of Regulators: 1
• Current - Output: 200mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Primary Input Voltage: 6V
• Output Voltage Fixed: 1.2V
• Dropout Voltage Vdo: 150mV
• No. Of Pins: 3
• Output Current: 200mA
• Operating Temperature Range: -40°C To +125°C
• Peak Reflow Compatible (260 C): Yes
• Package: 3SOT-23
• Function: LDO
• Number Of Outputs: 1
• Input Voltage Range: 6 to 2.3 V
• Output Voltage: 1.2 V
• Maximum Output Current: 0.2(Min) A
• Output Type: Fixed
• Accuracy: ±2 %
• Typical Dropout Voltage @ Current: 0.15@200mA V
• Polarity: Positive
• Input Voltage Max: 6 V
• Dropout Voltage (max): 350 mV
• Line Regulation: 0.75 % / V
• Load Regulation: 1 %
• Voltage Regulation Accuracy: 3 %
• Maximum Power Dissipation: 0.3696 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP1700T-1202E/TT; MCP1700T-1202E/TTTR

© 2007 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
L
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b1
Number of Leads
Pitch
Outside Lead Pitch
Overall Height
Overall Width
Molded Package Width at Base
Molded Package Width at Top
Overall Length
Tab Length
Foot Length
Lead Thickness
Lead 2 Width
Leads 1 & 3 Width
1
e
D1
D
e1
2
b
N
Dimension Limits
b1
E
H
C
Units
E1
D1
e1
b1
N
H
D
A
E
e
L
c
b
1.40
3.94
2.29
2.13
4.39
1.40
0.79
0.35
0.41
0.36
MIN
MILLIMETERS
1.50 BSC
3.00 BSC
3
MAX
1.60
4.25
2.60
2.29
4.60
1.83
1.20
0.44
0.56
0.48
Microchip Technology Drawing C04-029B
E1
MCP1700
DS21826B-page 17