LP38852MR-ADJ/NOPB National Semiconductor, LP38852MR-ADJ/NOPB Datasheet - Page 14

• Manufacturer Part Number: LP38852MR-ADJ/NOPB
• Description: IC REG LDO 1.5A LOW I/O 8-PSOP
• Manufacturer: National Semiconductor
• Series: PowerWise®r

Specifications of LP38852MR-ADJ/NOPB

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.8 ~ 1.8 V
• Voltage - Input: 0.93 ~ 5.5 V
• Voltage - Dropout (typical): 0.13V @ 1.5A
• Number Of Regulators: 1
• Current - Output: 1.5A (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-PSOP
• For Use With: LP38852EVAL - BOARD EVALUATION LP38852
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Other names: LP38852MR-ADJ

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heat-sink manufacturer datasheet for details and recommen-
dations.
Heat-Sinking The TO-263 Package
The TO-263 package has a θ
rating of 3°C/W. These ratings are for the package only, no
additional heat-sinking, and with no airflow.
The TO-263 package uses the copper plane on the PCB as
a heat-sink. The tab of this package is soldered to the copper
plane for heat sinking. shows a curve for the θ
package for different copper area sizes, using a typical PCB
with 1 ounce copper and no solder mask over the copper area
for heat-sinking.
Figure 3
square inch produces very little improvement. The minimum
value for θ
32°C/W.
Figure 4
TO-263 packages for different ambient temperatures, assum-
FIGURE 3. θ
FIGURE 4. Maximum Power Dissipation vs Ambient
shows the maximum allowable power dissipation for
shows that increasing the copper area beyond 1
Temperature for the TO-263 Package
JA
JA
for the TO-263 package mounted to a PCB is
vs Copper (1 Ounce) Area for the TO-263
package
JA
rating of 60°C/W, and a θ
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JA
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of TO-263
JC
14
ing θ
125°C.
Heat-Sinking The PSOP-8 Package
The LP38852MR package has a θ
a θ
the device DAP soldered to an area of 0.008 square inches
(0.09 in x 0.09 in) of 1 ounce copper, with no airflow.
Increasing the copper area soldered to the DAP to 1 square
inch of 1 ounce copper, using a dog-bone type layout, will
improve the θ
creasing the copper area beyond 1 square inch produces very
little improvement.
Figure 6
the PSOP-8 package for a range of ambient temperatures,
assuming that θ
perature is 125°C.
FIGURE 5. θ
FIGURE 6. Maximum Power Dissipation vs Ambient
JC
JA
rating of 11°C/W. The θ
is 35°C/W and the maximum junction temperature is
shows the maximum allowable power dissipation for
Temperature for the PSOP-8 Package
JA
JA
vs Copper (1 Ounce) Area for the PSOP-8
JA
rating to 98°C/W.
is 98°C/W and the maximum junction tem-
Package
JA
rating of 168°C/W includes
JA
Figure 5
rating of 168°C/W, and
shows that in-
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