BA06CC0T Rohm Semiconductor, BA06CC0T Datasheet - Page 6

• Manufacturer Part Number: BA06CC0T
• Description: IC REG LDO 1A 6V TO220FP
• Manufacturer: Rohm Semiconductor

Specifications of BA06CC0T

• Regulator Topology: Positive Fixed
• Voltage - Output: 6V
• Voltage - Input: Up to 25V
• Voltage - Dropout (typical): 0.3V @ 500mA
• Number Of Regulators: 1
• Current - Output: 1A (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: TO-220-3 Full Pack (Straight Leads)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -

●Thermal Design
●Peripheral Circuit Considerations
© 2009 ROHM Co., Ltd. All rights reserved.
BA□□DD0 Series,BA□□CC0 Series,
BA□□DD0W Series,BA□□CC0W Series
10
www.rohm.com
9
8
7
6
5
4
3
2
1
0
0
③ 7.3W
② 5.5W
① 2.3W
HRP-5
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The
IC characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature Tj
and long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from
thermal damage, it is necessary to operate it at temperatures lower than the maximum junction temperature Tj
Fig.30 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The method of calculating the power consumption Pc(W) is as follows.
Solving this for load current IO in order to operate within the acceptable loss:
It is then possible to find the maximum load current Io
・Calculation Example
・Vcc Terminal
・GND Terminal
・CTL Terminal
Board size : 70×70×1.6 ㎜
Board front copper foil area : 10.5×10.5 ㎜
①2-layer board (back surface copper foil area :15×15 ㎜
②2-layer board (back surface copper foil area :70×70 ㎜
③4-layer board (back surface copper foil area :70×70 ㎜
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Please attach a capacitor (greater than 0.33μF) between the Vcc and GND.
The capacitance values will differ depending on the application, so please take this into account when configuring the terminal.
Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not
arise between them.
If a potential difference arises between the set ground and the IC ground, the preset voltage will not be outputted, causing
the system to become unstable. Therefore, please reduce the impedance by making the ground patterns as wide as
possible and by reducing the distance between the set ground and the IC ground as much as possible.
The CTL terminal is turned ON at 2.0V and higher and OFF at 0.8V and lower within the operating power supply voltage range.
The power supply and the CTL terminal may be started up and shut down in any order without problems.
25
Pc = (Vcc-Vo) × Io ＋ Vcc × Icca
Acceptable loss Pd≦Pc
Io≦
Io≦
Io≦200mA (Icca : 2mA)
Pc=Vcc×(Icca＋Ishort)
Ambient temperature:Ta(℃）
Fig.29
50
Pd – Vcc×Icca
1.04－8.3×Icca
Vcc－Vo
75
3
（board contains a thermal via）
5
100
MAX
2
., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction
125
(Please refer to Figs.8 and 20 for Icca.)
2
2
2
)
)
)
150
*Ishort : Short circuit current
With the IC alone : θja=62.5℃/W → -16mW/℃
25℃=2000mW → 85℃=1040mW
25
20
15
10
5
0
（ 1 ） 20.0
（ 2 ） 2.0
0
TO220FP-5
（1）
（2）
25
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-6=62.5(℃/W)
MAX
Ambient temperature:Ta(℃）
50
Fig.30
with respect to the applied voltage Vcc at the time of thermal design.
6/9
75
100
125
150
Vcca：
Vcc：
Vo：
Io：
Input voltage
Output voltage
Load current
Circuit current
2.0
1.6
1.2
0.8
0.4
0.0
0
TO252-5
1.30
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
25
Ambient temperature:Ta(℃）
50
Fig.31
Technical Note
2009.04 - Rev.A
75
MAX
100
of the IC.
125
150