B72500D90A60 EPCOS Inc, B72500D90A60 Datasheet - Page 13

• Manufacturer Part Number: B72500D90A60
• Description: CERADIODE 9VDC 30A 0603
• Manufacturer: EPCOS Inc
• Series: CeraDioder

Specifications of B72500D90A60

• Package / Case: 0603 (1608 Metric)
• Varistor Voltage: 10V
• Current-surge: 30A
• Number Of Circuits: 1
• Maximum Dc Volts: 9VDC
• Polarity: Bidirectional
• Clamping Voltage: 30 V
• Operating Voltage: 9 V
• Breakdown Voltage: 10 V
• Termination Style: SMD/SMT
• Peak Surge Current: 30 A
• Peak Pulse Power Dissipation: 1600 W
• Capacitance: 220 pF
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Diode Type: ESD Protection
• Clamping Voltage Vc Max: 30V
• Diode Case Style: 0603
• Operating Temperature Range: -40°C To +85°C
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 85C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Energy: -
• Maximum Ac Volts: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-3415-2; B72500D 90A 60; B72500D0090A060; CDS3C09GTA

2
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
The components are suitable for reflow soldering to JEDEC J-STD-020D.
3
3.1
The component is fixed onto the circuit board with cement prior to soldering. It must still be able
to move slightly. When the board is placed into the reflow oven, excessively rigid fixing can lead
to high forces acting on the component and thus to a break. In addition, too much cement can
lead to unsymmetrical stressing and thus to mechanical fracture of the component. The cement
must also be so soft during mounting that no mechanical stressing occurs.
3.2
It is best to mount the components on the board before soldering so that one termination does not
enter the oven first and the second termination is soldered subsequently. The ideal case is simul-
taneous wetting of both terminations.
3.3
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.
As the solder cools down, the solder contracts in the direction of the component. If there is too
much solder on the component, it has no leeway to evade the stress and may break, as in a vise.
Please read Cautions and warnings and
Important notes at the end of this document.
CeraDiodes
Standard series
Soldering guidelines
Solder joint profiles / solder quantity
Cement quantity
Mounting the components on the board
Solder joint profiles
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