PMR50HZPFU5L00 Rohm Semiconductor, PMR50HZPFU5L00 Datasheet - Page 12

RES .005 OHM 1W 1% 2010 SMD

PMR50HZPFU5L00

Manufacturer Part Number
PMR50HZPFU5L00
Description
RES .005 OHM 1W 1% 2010 SMD
Manufacturer
Rohm Semiconductor
Series
PMR50r
Datasheets

Specifications of PMR50HZPFU5L00

Resistance (ohms)
0.005
Power (watts)
1W
Composition
Thick Film
Features
Current Sense
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.197" L x 0.098" W (5.00mm x 2.50mm)
Height
0.020" (0.51mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
2010 (5025 Metric)
Resistance In Ohms
0.005
Case
2010 (5025 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PMR50HZPFU5L00
RHM.005ASTR
9. RECOMMENDABLE CONDITION OF SOLDERING
10.OTHERS
TSZ22111・05・002
10.5 Requests prior to changes
10.6 Manufacturing flow chart and basic design quality
9.1 Reflow Soldering
9.2 Reworking of soldering
10.1 In regard to the Export Trade Control Decree.
10.2 On use of ozone layer destroying substances
10.3 On use of fluorocarbons
10.4 Regarding specific bromine type fire resistant materials
and the basic quality will be submitted separately.
Reworking of soldering shall be limited to one time.
① Temperature of soldering tip : 350℃ or less
② Working time : Not longer than 3s.
③ Soldering iron : 20W or less.
Since fixed resistors and such are not specified as an item in separate Table.1 of the
Export Trade Control Decree, it is deemed that this item obviously does not apply as a
strategic commodity. Consequently, we trust you will understand that there are no non-
applicable certificates or parameter sheets.
No ozone layer destroying substances are used in our resistors
No specific fluorocarbons or alternative fluorocarbons are used in the manufacture of
our resistors.
None of the following specific bromine type materials are used in our resistors.
① PBB0s
② PBBs
In the manufacture and utilization of the chip resistors there are conditions that develop
which require materials or processes to be changed. In such cases, request will be made
prior to clang to obtain approval.
As requested specially, the flow chart for the manufacturing processes of the chip resistor
Time
Reflow soldering with lead free solder.
Condition of soldering
Maximum temperature : 260±5℃ less than 10s.
PRODUCTS
ULTRA LOW OHMIC RESISTORS
REV.:
350
300
250
200
150
100
50
0
0
008E
: Maximum of twice.
: Reflow zone 220℃ less than 60s.
: Preheat 150~180℃ less than 120s.
1
150~180℃
max. 120s
260±5℃
max. 10s
(min)
2
TYPE
SPECIFICATION No.:PMR50-IA
220℃ over
max. 60s
3
PMR50 Series
4
PAGE
12/16

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