CN1206K20G EPCOS Inc, CN1206K20G Datasheet - Page 73
![VARISTOR 20VRMS 1206 SMD](/photos/1/40/14091/495-varistor_tvs_series_1206_sml.jpg)
CN1206K20G
Manufacturer Part Number
CN1206K20G
Description
VARISTOR 20VRMS 1206 SMD
Manufacturer
EPCOS Inc
Series
CN Standardr
Specifications of CN1206K20G
Varistor Voltage
33V
Current-surge
200A
Number Of Circuits
1
Maximum Ac Volts
20VAC
Maximum Dc Volts
26VDC
Energy
0.70J
Package / Case
1206 (3216 Metric)
Technology
Metal Oxide
Capacitance Value
600pF
Clamping Current
1A
Clamping Voltage
54V
Ac Voltage Rating (max)
20VAC
Dc Voltage Rating (max)
26VDC
Operating Temp Range
-55C to 125C
Mounting
Surface Mount
Surge Current (max)
200A
Size Code
1206
Product Length (mm)
3.2mm
Product Depth (mm)
1.6mm
Product Height (mm)
1.7mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72520V 200K 62
B72520V0200K062
B72520V200K62
B72520V0200K062
B72520V200K62
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 73 of 81
As mounted on substrate