FX12B-24S-0.4SV Hirose Electric Co Ltd, FX12B-24S-0.4SV Datasheet - Page 7
![CONN RCPT 24POS 0.4MM SMD SHIELD](/photos/1/72/17278/fx12b-24s-0_4sv_sml.jpg)
FX12B-24S-0.4SV
Manufacturer Part Number
FX12B-24S-0.4SV
Description
CONN RCPT 24POS 0.4MM SMD SHIELD
Manufacturer
Hirose Electric Co Ltd
Series
FX12r
Datasheet
1.FX12B-24S-0.4SV.pdf
(10 pages)
Specifications of FX12B-24S-0.4SV
Pitch
0.016" (0.40mm)
Connector Type
Receptacle, Outer Shroud Contacts
Number Of Positions
24
Number Of Rows
2
Mounting Type
Surface Mount
Features
Solder Retention
Contact Finish
Gold
Mated Stacking Heights
1.5mm
Height Above Board
0.047" (1.20mm)
Product Type
Receptacles
Mounting Style
SMD/SMT
Mounting Angle
Vertical
Number Of Positions / Contacts
24
Contact Material
Phosphor Bronze
Contact Plating
Gold
Voltage Rating
30 V
Current Rating
0.3 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
H11406TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FX12B-24S-0.4SV
Manufacturer:
CK
Quantity:
450
Company:
Part Number:
FX12B-24S-0.4SV
Manufacturer:
Hirose Electric Co Ltd
Quantity:
3 000
Company:
Part Number:
FX12B-24S-0.4SV(30)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BRecommended solder temperature profile.
Note: The temperature profile indicates the maximum temperature
BCleaning recommendations
Organic solvent cleaning
Water based cleaning
When using water based cleaning agents (e.g., terpene, alkali saponifiers), select the cleaning agent based on the documentation
issued by the various manufacturers of cleaning agents which describes it’s affects on metals, platings and plastics. Remove any
moisture after cleaning. Residual flux or cleaning agents in the contact areas may affect electrical performance.
260
240
220
200
180
160
140
IPA (Isoporopyl alcohol)
HCFC (Hydrochlorofluorocarbon)
of the connector surfaces at the highest point from the PCB
mounting surface.
0
Solvent type
150ç
(90~120sec.)
200ç
(MAX 60sec.)
Room temperature cleaning
MAX 250ç
220ç
FX12 Series●0.4 mm Pitch, 1.5 mm Board-to-Board Connectors with Dual Shields
Time (Seconds)
YES
YES
< HRS test conditions >
Solder method
Environment
Solder paste
Test board
Metal mask
Reflow cycles
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may very,
depending on solder paste type, volume / thickness and
board size/ thickness. Cosult your solder paste and
equipment manufacture for specific recommendations.
Heated cleaning
YES
YES
:Reflow
:Room air
:96.5%Sn/3.0%Ag/0.5%Cu
:Glass epoxy 40mm∞30mm∞1mm
:0.12mm thick
:2cycles
thick
A269