TJF1051T/3,118 NXP Semiconductors, TJF1051T/3,118 Datasheet
TJF1051T/3,118
Specifications of TJF1051T/3,118
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TJF1051T/3,118 Summary of contents
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TJF1051 High-speed CAN transceiver Rev. 01 — 10 August 2010 1. General description The TJF1051 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Name TJF1051T/3 SO8 4. Block diagram TXD RXD Fig 1. TJF1051 Product data sheet Description plastic small outline package; 8 leads; body width 3 TEMPERATURE PROTECTION TIME-OUT 8 MODE S CONTROL 4 DRIVER Block diagram All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. 5.2 Pin description Table 2. Symbol TXD GND V CC RXD V IO CANL CANH S TJF1051 Product data sheet 1 TXD GND RXD Pin configuration diagram Pin description Pin Description 1 transmit data input 2 ground supply 3 supply voltage 4 receive data output; reads out data from the bus lines ...
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... NXP Semiconductors 6. Functional description The TJF1051 is a stand-alone high-speed CAN transceiver with Silent mode. It combines the functionality of the TJA1050 transceiver with improved EMC and ESD handling capability. Improved slope control and high DC handling capability on the bus pins provides additional application flexibility. ...
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... NXP Semiconductors 6.2.3 Undervoltage detection on pins V Should V and V uvd (VIO) (zero load) until V 6.2.4 Overtemperature protection The output drivers are protected against overtemperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, T disabled until the virtual junction temperature falls below T recessive again ...
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... NXP Semiconductors Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V electrostatic discharge voltage ESD T ambient temperature amb [1] Human Body Model (HBM): 100 pF, 1.5 kΩ. Machine Model (MM): 200 pF, 0.75 μH, 10 Ω. ...
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... NXP Semiconductors Table 6. Static characteristics = −40 °C to +85 ° amb CC ground; positive currents flow into the IC. Symbol Parameter CAN transmit data input; pin TXD V HIGH-level input voltage IH V LOW-level input voltage IL I HIGH-level input current IH I LOW-level input current IL C input capacitance i CAN receive data output ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics = −40 °C to +85 ° amb CC ground. Positive currents flow into the IC. Symbol Parameter Transceiver timing; pins CANH, CANL, TXD and RXD; see t delay time from TXD to bus dominant d(TXD-busdom) t delay time from TXD to bus recessive ...
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... NXP Semiconductors TXD CANH CANL V O(dif)(bus) RXD t d(TXD-busdom) Fig 5. TJF1051 Product data sheet 0. d(busdom-RXD) t PD(TXD-RXD) CAN transceiver timing diagram All information provided in this document is subject to legal disclaimers. Rev. 01 — 10 August 2010 TJF1051 High-speed CAN transceiver 0.9 V 0.5 V 0.7V t d(TXD-busrec PD(TXD-RXD) © ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 7. For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Revision history Table 10. Revision history Document ID Release date TJF1051 v.1 20100810 TJF1051 Product data sheet maximum peak temperature = MSL limit, damage level temperature ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4 6.1.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.1.2 Silent mode ...