73M1866B-IFX Maxim Integrated Products, 73M1866B-IFX Datasheet - Page 14

• Manufacturer Part Number: 73M1866B-IFX
• Description: KIT EVALUATION FOR 73M1866B
• Manufacturer: Maxim Integrated Products

Specifications of 73M1866B-IFX

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

73M1866B/73M1966B Schematic and Layout Guidelines
Revision History
14
Revision
July 2007
1.1
2.2
3.0
3.1
3.2
3.3
3.4
3.5
Date
7/25/2007
9/14/2007
2/4/2008
4/17/2008
5/14/2008
7/25/2008
2/20/2009
7/29/2009
10/9/2009
Description
First publication.
Replaced the schematic in Figure 3.
Changed all instances of “73M1966” to “73M1966B” to document the new chip
revision. Changed all instances of “73M1906” to “73M1906B”.
Added a new Special Considerations section.
Added layout guidelines and information specific to the 73M1866B.
Added a new section, Exposed Bottom Pad on 73M1x66B QFN Packages.
In Figure 5, replaced the schematic. The new schematic renames pin 38 from N/C to
M20PB.
In Special Layout Considerations for the 73M1866B, added two reference documents
for additional information.
In Exposed Bottom Pad on 73M1x66B QFN Packages, added “Soldering of the
exposed pad could also contribute to “QFN float”, where the outside pad connections
are compromised because of the package sitting higher than the optimum height due
to excess solder on the center pads. There are ways to avoid this using a segmented
stencil for the solder application, but since there isn’t any benefit to soldering the pad,
leaving it unsoldered is advised.”.
Added revised schematics with new information about optional components.
Added the Cost Reducing the Design section.
Added explanation about protection devices to the Connections to Tip and Ring
section.
Updated the schematics in Figure 4 and Figure 5.
In the Reference Schematics and Layout Examples section, added the third bullet.
Added the Pulse Transformer Considerations section.
AN_1x66B_003
Rev. 3.5