ACPM-7357-BLK Avago Technologies US Inc., ACPM-7357-BLK Datasheet

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ACPM-7357-BLK

Manufacturer Part Number
ACPM-7357-BLK
Description
IC PA MOD UMTS BAND1/8 14-SMD
Manufacturer
Avago Technologies US Inc.
Type
Power Amplifierr
Datasheet

Specifications of ACPM-7357-BLK

Package / Case
14-SMD Module
Current - Supply
400mA
Frequency
890MHz ~ 915MHz, 1.92GHz ~ 1.98GHz
Gain
27.3dB
Rf Type
UMTS
Test Frequency
1.92GHz ~ 1.98GHz
Voltage - Supply
3.2V ~ 4.2V
Operating Frequency
1980 MHz
Supply Current
450 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 30 C
Number Of Channels
2 Channels
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Noise Figure
-
P1db
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
ACPM-7357
UMTS Dual-Band 4x5mm Power Amplifier Module
(Band1/Band8)
Data Sheet
Description
The ACPM-7357 is a dual-band PAM (Power Amplifier
Module) designed for UMTS Band1 and Band8. The ACPM-
7357 meets stringent UMTS linearity requirements. The
4mmx5mm form factor 14-pin surface mount package
is self contained, incorporating 50ohm input and output
matching networks
The ACPM-7357 features 5
circuit technology which supports 3 modes – bypass, mid
and high power modes. The CoolPAM is stage bypass
technology which enables power amplifier to lower
power consumption. Active bypass feature is added to
5
output range and this technology extends talk time of
mobiles more by further saving power amplifier’s current
consumption.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology
offering state-of-the-art reliability, temperature stability
and ruggedness
The Module is housed in a cost effective, small and thin
4x5mm package.
Block Diagram
RFin_HB
RFin_LB
Ven_HB
Ven_LB
th
Vcc1
generation to enhance power added efficiency at low
Input Match &
Power Divider
Input Match &
Power Divider
Bias Circuit & Control Logic
Bypass
Circuit
Bypass
Circuit
th
generation of CoolPAM
Transformer
Transformer
Impedance
Impedance
Output
Output
Match
Match
RFout_LB
Vcc2
Vmode
Vbp
RFout_HB
Features
x Dual-Band PA (Band1 and Band8)
x Small Size (4x5mm)
x Thin Package (1.0mm typ)
x Excellent Linearity
x 3-mode power control
x High Efficiency at max output power
x 14-pin surface mounting package
x Internal 50ohm matching networks for both RF input
x Lead-free, RoHS compliant, Green
Applications
x UMTS Band1 and Band8
Ordering Information
Part Number
ACPM-7357-TR1
ACPM-7357-BLK
Bypass / Mid Power Mode / High Power Mode
and output
Number of
Devices
1000
100
Container
178mm (7”) Tape/Reel
Bulk

Related parts for ACPM-7357-BLK

ACPM-7357-BLK Summary of contents

Page 1

... High Efficiency at max output power x 14-pin surface mounting package x Internal 50ohm matching networks for both RF input and output x Lead-free, RoHS compliant, Green Applications x UMTS Band1 and Band8 Ordering Information Part Number ACPM-7357-TR1 ACPM-7357-BLK Output RFout_LB Match Vcc2 Vmode Vbp Output RFout_HB Match ...

Page 2

Absolute Maximum Ratings No damage assuming only one parameter is set at limit at a time with all other parameters set at or below typical value. Operation of any single parameter outside these conditions with the remaining parameters set at ...

Page 3

Electrical Characteristics in Band1 – Conditions: Vcc=3.4V, Ven_Hi=2.6V, T=25°C, Zin/Zout=50ohm – Signal Configuration: 3GPP (DPCCH+1DPDCH) Up-Link unless specified otherwise Characteristics Operating Frequency Range Gain Total Supply Current Quiescent Current Enable Current Mode Control Current Bypass Control Current Total Current in ...

Page 4

Electrical Characteristics in Band8 – Conditions: Vcc=3.4V, Ven_Low=2.6V, T=25°C, Zin/Zout=50ohm – Signal Configuration: 3GPP (DPCCH+1DPDCH) Up-Link unless specified otherwise Characteristics Operating Frequency Range Gain Total Supply Current Quiescent Current Enable Current Mode Control Current Bypass Control Current Total Current in ...

Page 5

HSDPA Signal configuration used: 3GPP TS 34.121-1 Annex C (normative e): Measurement channels C.10.1 UL reference measurement channel for HSDPA tests Table C.10.1.4: E values for transmitter characteristics tests with HS-DPCCH Sub-test 2 (CM=1.0, MPR=0.0) HSUPA signal configuration used: 3GPP ...

Page 6

Characteristics Data of Band1 (Vcc=3.4V, Ven_Hi=2.6, Vbp, Vmode 2.6V, T=25°C, Zin/Zout=50ohm, Rel99) 500 450 1920MHz, 3.4V 1950MHz, 3.4V 400 1980MHz, 3.4V 350 300 250 200 150 100 Pout (dBm) Total Current ...

Page 7

Characteristics Data of Band8 (Vcc=3.4V, Ven_Low=2.6, Vbp and Vmode 2.6V, T=25°C, Zin/Zout=50ohm, Rel99) 500 880MHz, 3.4V 450 898MHz, 3.4V 400 915MHz, 3.4V 350 300 250 200 150 100 Pout (dBm) Total ...

Page 8

Footprint All dimensions are in millimeter XRAY TOP VIEW Package Dimensions All dimensions are in millimeter Pin 1 Mark ± 0.1 8 PIN DESCRIPTIONS Pin ...

Page 9

... AAAAA CoolPAM Avago Technologies’ CoolPAM is stage-bypass PA technol- ogy which saves more power compared with convention- al PA. With this technology, the ACPM-7357 has very low quiescent current, and efficiencies at low and medium output power ranges are high. Incorporation of bias circuit The ACPM-7357 has internal bias circuit, which removes the need for external constant voltage source (LDO). PA on/off ...

Page 10

... HIGH ~17dBm HIGH HIGH ~8dBm LOW LOW – th The 5 generation of CoolPAM technology, ACPM-7357 can dramatically reduce Icc down to 3mA at bypass mode, which improves overall talk time and battery usage time of handset more compared with the CP4 CP5 CP4 Pout (HSDPA, HSUPA MPR=0dB) ~26 ...

Page 11

... PA_ON _High Band High TX filter C9 Figure 3. Peripheral Circuits PCB layout and part placement on phone board 2 4 Figure 4. PCB guideline on phone board 11 C10 C11 ACPM-7357 Low IN Low OUT Vmode GND Vbp GND Vcc1 Vcc2 output matching circuit GND Ven_L Ven_H GND High IN ...

Page 12

Metallization 0.50 0.60 0.40 0.73 0.25 ø 0.3 Via on 0.6 pitch Solder Mask Opening 0.55 0.70 0.50 0.73 2.40 Solder Paste Stencil Aperture 0.50 0.60 0.40 0.73 2.00 12 PCB Design Guidelines The recommended PCB land pattern is shown ...

Page 13

... Vmode C6 100pF Vbp C5 100pF Vcc1 C3 C4 Ven_Band8 1000pF 2.2uF C2 Ven_Band1 100pF C1 Band1 RF In 100pF Evaluation Board Description AVAGO ACPM-7357 C4 PYYWW AAAAA 13 1 RFIn_Low RFOut_Low 14 GND 13 2 Vmode GND 12 3 Vbp Vcc2 11 4 Vcc1 C7 1000pF GND 10 5 Ven_Low GND 9 6 Ven_Hi 7 RFIn_Hi ...

Page 14

... Dimension List Dimension Millimeter A0 4.40±0.10 B0 5.30±0.10 K0 1.20±0.10 D0 1.55±0.05 D1 1.60±0.10 P0 4.00±0.10 P1 8.00±0.10 Tape and Reel Format – Dimension Millimeter P2 2.00±0.05 P10 40.00±0.20 E 1.75±0.10 F 5.50±0.05 W 12.00±0.30 T 0.30±0.05 AVAGO ACPM-7357 PYYWW AAAAA ...

Page 15

Reel Drawing BACK VIEW 25 min wide (ref) Slot for carrier tape insertion for attachment to reel hub (2 places 180° apart) FRONT VIEW Plastic Reel Format (all dimensions are in millimeters) 15 Shading indicates thru slots +0.4 178 -0.2 ...

Page 16

... After this time period, the part would need to be removed from the reel, de-taped and then re-baked. MSL classification reflow temperature for the ACPM-7357 is targeted at 260°C +0/-5°C. Figure and table on next page show typical SMT profile for maximum temperature of 260 +0/-5°C. ...

Page 17

Reflow Profile Recommendations smax T smin ts Preheat 25 t 25°C to Peak Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C Typical SMT Reflow Profile for Maximum Temperature = 260 +0/ -5°C Profile Feature ...

Page 18

Storage Condition Packages described in this document must be stored in sealed moisture barrier, antistatic bags. Shelf life in a sealed moisture barrier bag is 12 months at <40°C and 90% relative humidity (RH) J-STD-033 p.6. Out-of-Bag Time Duration After ...

Page 19

Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C, 35°C For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reflow at same temperature at which the component was classified) Maximum Percent Relative Humidity Maximum Percent Relative Humidity Package Type ...

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