MMG3015NT1 Freescale Semiconductor, MMG3015NT1 Datasheet - Page 10

• Manufacturer Part Number: MMG3015NT1
• Description: TRANS HBP 20.5DBM 15DB SOT-89
• Manufacturer: Freescale Semiconductor

Specifications of MMG3015NT1

• Current - Supply: 95mA
• Frequency: 0Hz ~ 6GHz
• Gain: 15.5dB
• Noise Figure: 5.6dB
• P1db: 20.5dBm
• Package / Case: SC-62, SOT-89, TO-243 (3 Leads + Tab)
• Rf Type: Cellular, PCS, PHS, WLL
• Test Frequency: 900MHz
• Voltage - Supply: 5V
• Manufacturer's Type: Linear Amplifier
• Number Of Channels: 1
• Supply Current: 120@5VmA
• Frequency (max): 6GHz
• Operating Supply Voltage (typ): 5V
• Package Type: SOT-89
• Mounting: Surface Mount
• Pin Count: 3 +Tab
• Noise Figure (typ): 5.6@900MHzdB
• Rf Transistor Case: SOT-89
• Peak Reflow Compatible (260 C): Yes
• Filter Terminals: SMD
• Leaded Process Compatible: Yes
• Output Third Order Intercept Point, Ip3: 36dB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MMG3015NT1; MMG3015NT1TR

MMG3015NT1
10
0.86
1.27
Recommended Solder Stencil
0.64
3.86
1.7
3.48
0.58
Figure 20. Recommended Mounting Configuration
5.33
1.27
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
USED IN PCB LAYOUT DESIGN.
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
PITCH.
7.62
Freescale Semiconductor
2.49
2.54
0.305 diameter
RF Device Data