MMG3005NT1 Freescale Semiconductor, MMG3005NT1 Datasheet - Page 19

• Manufacturer Part Number: MMG3005NT1
• Description: IC AMP RF GP 2200MHZ 5V 16-PQFN
• Manufacturer: Freescale Semiconductor

Specifications of MMG3005NT1

• Current - Supply: 480mA
• Frequency: 800MHz ~ 2.2GHz
• Gain: 15dB
• Noise Figure: 5dB
• P1db: 30dBm
• Package / Case: 16-PQFN, 16-PowerQFN
• Rf Type: Cellular, PCS, PHS, WLL
• Test Frequency: 2.14GHz
• Voltage - Supply: 5V
• Noise Figure Typ: 5dB
• Supply Current: 480mA
• Rf Ic Case Style: PQFN
• No. Of Pins: 16
• Operating Temperature Range: -65°C To +150°C
• Frequency Max: 2.2GHz
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Rf Transistor Case: PQFN
• Peak Reflow Compatible (260 C): Yes
• Leaded Process Compatible: Yes
• Output Third Order Intercept Point, Ip3: 47dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MMG3005NT1; MMG3005NT1TR

RF Device Data
Freescale Semiconductor
Application Notes
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
• AN3100: General Purpose Amplifier Biasing
• AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation
Software
• .s2p File
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
Revision
Refer to the following documents to aid your design process.
The following table summarizes revisions to this document.
3
4
5
6
7
June 2009
Feb. 2008
Mar. 2007
May 2010
Apr. 2008
Date
• Corrected Fig. 24, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
• Replaced Case Outline 1543--02 with updated 1543--03, Issue C, p. 1, 16--18
• Added V
• Updated Part Numbers in Table 8, Component Designations and Values, 900 MHz, to RoHS compliant part
• Corrected circuit board callouts, V
• Removed I
• Updated Part Numbers in Table 9, Component Designations and Values, 1800--2200 MHz, to RoHS
• Corrected circuit board callouts, V
• Removed I
• Added Product Documentation and Revision History, p. 19
• Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
• Changed Table 4, Electrical Characteristics Supply Current Min value from 455 mA to 420 mA, p. 2
• Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
• Corrected Tape and Reel information from 12 mm, 7 inch Reel to 16 mm, 13 inch Reel, p. 1
• Replaced Case Outline 1543--03, Issue C, with 1543--04, Issue D, p. 1, 16--18. Corrected I/O dimension
• Corrected temperature at which ThetaJC is measured from 25°C to 100°C, Thermal Characteristics
• Added new Fig. 3, Third Order Output Intercept Point versus Output Power and Supply Current,
• Added AN3778, PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat
• Added .s2p File availability to Product Software, p. 19
numbers, p. 5
Layout, 900 MHz, p. 6
Ratio versus Output Power, 900 MHz, p. 8
compliant part numbers, p. 9
Layout, 1800--2200 MHz, p. 10
Ratio versus Output Power, 1800--2200 MHz, and Fig. 24, Single--Carrier W--CDMA Adjacent Channel
Power Ratio versus Output Power, 1800--2200 MHz, p. 12
p. 1
frequency values from GHz to MHz, p. 13, 14
(ACPR) unit of measure to dBc, p. 12
from 0.95--1.2 mm to 0.925--1.175 mm.
table, p. 1
p. 4
Dissipation, Application Notes, p. 19
PRODUCT DOCUMENTATION AND SOFTWARE
CC
DC
DC
callout to Pin Connections 10, 11, and 12 in Fig. 1, Pin Connections, p. 3
value due to its variability over temperature, Figs. 12--13, IS--95 Adjacent Channel Power
value due to its variability over temperature, Figs. 22--23, IS--95 Adjacent Channel Power
REVISION HISTORY
p
p
to V
to V
BA
BA
and V
and V
Description
CC
CC
to V
to V
SUPPLY
SUPPLY
, Fig. 5, 50 Ohm Test Circuit Component
, Fig. 15, 50 Ohm Test Circuit Component
MMG3005NT1
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