RMPA0965 Fairchild Semiconductor, RMPA0965 Datasheet
RMPA0965
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RMPA0965 Summary of contents
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... Vref ©2005 Fairchild Semiconductor Corporation RMPA0965 Rev. F General Description The RMPA0965 power amplifier module (PAM) is designed for cellular band AMPS, CDMA, CDMA2000-1X, WCDMA and HSDPA applications. The 2 stage PAM is internally matched to 50 Ohms to minimize the use of external components and fea- tures a low-power mode to reduce standby current and DC power consumption during peak phone usage ...
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... Case Operating Temperature DC Characteristics Iccq Quiescent Current Iref Reference Current Icc(off) Shutdown Leakage Current Notes: 1. All parameters met +25°C, Vcc = +3.4V, Freq = 836.5MHz, Vref = 2.85V and load VSWR otherwise noted. 2. All phase angles. 3. Guaranteed by design. RMPA0965 Rev. F Parameter 1 Min Typ Max 824 849 ...
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... Vcc=3.4V, Vref = 2.85V, Vmode=0V, Pout=28dBm 500 490 480 470 460 450 440 430 420 410 400 824 836.5 Frequency (MHz) RMPA0965 Rev RMPA0965 Cellular 3x3mm PAM Vcc=3.4V, Vref = 2.85V, Vmode=0V, Pout=28dBm -40 -42 -44 -46 -48 -50 -52 -54 -56 -58 -60 849 824 2 RMPA0965 Cellular 3x3mm PAM Vcc=3 ...
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... Pout Linear Output Power (High-Power) (Low-Power) Tc Case Operating Temperature DC Turn-On Sequence 1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16 dBm) Low-Power: Vmode = 2V (Pout < 16 dBm) RMPA0965 Rev. F Parameter Min 824 3.0 2.7 1.8 -30 4 Typ Max Units ...
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... GRM39X7R331K50V A/R 9 SN63 A/R 10 SN96 Evaluation Board Shematic Vcc1 SMA1 RF IN Vmode 1000 pF RMPA0965 Rev Part Number Description PC Board SMA Connector Terminals Assembly, RMPA0965 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3µF Capacitor (1206) 0.1µF Capacitor (0603) 0.1µF Capacitor (0603) ...
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... SQ. –.050 3 4 1.10mm MAX. 4X R.20mm 4 BACK SIDE SOLDER MASK SEE DETAIL A 0.80mm Signal Descriptions Pin No RMPA0965 Rev. F TOP VIEW FRONT VIEW 5 6 2.65mm 1.40mm 0.175mm BOTTOM VIEW Symbol Vcc1 Supply Voltage to Input Stage Input Signal Vmode High-Power/Low-Power Mode Control ...
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... RMPA0965 Rev. F Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. • Reflow Profile – Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A typical heating rate is 1- 2° ...
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... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete RMPA0965 Rev. F POP™ IntelliMAX™ Power247™ ISOPLANAR™ PowerEdge™ LittleFET™ MICROCOUPLER™ PowerSaver™ MicroFET™ ...