WS2111-TR1 Avago Technologies US Inc., WS2111-TR1 Datasheet - Page 17

• Manufacturer Part Number: WS2111-TR1
• Description: MODULE PA UMTS850 4X4MM 10-PIN
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of WS2111-TR1

• Package / Case: 10-DFN
• Current - Supply: 475mA
• Frequency: 824MHz ~ 849MHz
• Gain: 25dB ~ 28dB
• Rf Type: W-CDMA, HSPDA
• Voltage - Supply: 3.2V ~ 4.2V
• Operating Frequency: 849 MHz
• Operating Supply Voltage: 4.2 V
• Supply Current: 475 mA
• Maximum Operating Temperature: + 90 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 20 C
• Number Of Channels: 1 Channel
• Frequency (max): 849MHz
• Output Power: 28dBm
• Power Supply Requirement: Dual
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (typ): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Package Type: SMD
• Dual Supply Voltage (min): 3.2/3.2V
• Dual Supply Voltage (typ): 3.4V
• Dual Supply Voltage (max): 4.2V
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 90C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

17
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs
naturally in the environment.
With the increase in voltage
potential, the outlet of neutraliza-
tion or discharge will be sought.
If the acquired discharge route is
through a semiconductor device,
destructive damage will result.
ESD countermeasure methods
should be developed and used to
control potential ESD damage
during handling in a factory
environment at each manufactur-
ing site.
Table 7. ESD Classification
Pin#
1
2
3
4
5
6
7
8
9
10
Note:
1. Module products should be considered extremely ESD sensitive.
Table 8. Moisture Classification Level and Floor Life
MSL Level
1
2
2a
3
4
5
5a
6
Note:
1. The MSL Level is marked on the MSL Label on each shipping bag.
Name
Vref
Vcont
GND
RF In
Vcc1
Vcc2
GND
RFOut
GND
GND
Floor Life (out of bag) at factory ambient ≤ 30°C/60% RH or as stated
Unlimited at ≤ 30
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
o
C/85% RH
Description
Reference Voltage
Control Voltage
Ground
RF Input
Supply Voltage
Supply Voltage
Ground
RF Output
Ground
Ground
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface
mount package is sensitive to
damage induced by absorbed
moisture and temperature.
Agilent Technologies follows
JEDEC Standard J-STD 020B.
Each component and package
type is classified for moisture
sensitivity by soaking a known
dry package at various
temperatures and relative
humidity, and times. After soak,
the components are subjected to
three consecutive simulated
reflows.
The out of bag exposure time
maximum limits are determined
by the classification test
HBM
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
CDM
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
described below which corre-
sponds to a MSL classification
level 6 to 1 according to the
JEDEC standard IPC/JEDEC
J-STD-020B and J-STD-033.
WS2111 is MSL3. Thus, according
to the J-STD-033 p.11 the maxi-
mum Manufacturers Exposure
Time (MET) for this part is
168 hours. After this time period,
the part would need to be
removed from the reel, de-taped
and then re-baked.
MSL classification reflow
temperature for the WS2111 is
targeted at 250° C +0/-5° C. Figure
32 and Table 9 show typical SMT
profile for maximum tempera-
ture of 250+0/-5° C.
Classification
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2