ACPM-7331-OR1 Avago Technologies US Inc., ACPM-7331-OR1 Datasheet - Page 14

IC PA MOD WCDMA UMTS1900 10-SMD

ACPM-7331-OR1

Manufacturer Part Number
ACPM-7331-OR1
Description
IC PA MOD WCDMA UMTS1900 10-SMD
Manufacturer
Avago Technologies US Inc.
Type
High Speed Optocouplerr
Datasheet

Specifications of ACPM-7331-OR1

Current - Supply
625mA
Frequency
1.85GHz ~ 1.91GHz
Gain
27dB
Package / Case
10-SMD Module
Rf Type
W-CDMA
Voltage - Supply
3.2V ~ 4.2V
Operating Frequency
1910 MHz
Supply Current
690 mA
Maximum Operating Temperature
+ 90 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 20 C
Number Of Channels
1 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
P1db
-
Test Frequency
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ACPM-7331-OR1
Manufacturer:
AVAGO
Quantity:
16 730
Part Number:
ACPM-7331-OR1
Manufacturer:
QUALCOMM
Quantity:
129
Part Number:
ACPM-7331-OR1
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device, de-
structive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive
to damage induced by absorbed moisture and tempera-
ture.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
Table 6. ESD Classification
Note :
1. Module products should be considered extremely ESD sensitive.
Table 7. Moisture Classification Level and Floor Life
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
4
Pin #


3
4
5
6
7
8
9
0
Level
MSL
a
5a


3
4
5
6
Floor Life (out of bag) at factory ambient
=< 30°C/60% RH or as stated
Unlimited at =< 30oC/85% RH
 year
4 weeks
68 hours
7 hours
48 hours
4 hours
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Name
Vcc
RF In
Vmode
Vmode0
Ven
GND
GND
RF Out
GND
Vcc
Description
Supply Voltage
RF Input
Control Voltage
Control Voltage
Enable Voltage
Ground
Ground
RF Output
Ground
Supply Voltage
± 000V
± 000V
± 000V
± 000V
± 000V
± 000V
± 000V
± 000V
± 000V
± 000V
HBM
± 00V
± 00V
± 00V
± 00V
± 00V
± 00V
± 00V
± 00V
± 00V
± 00V
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three con-
secutive simulated reflows.
The out of bag exposure time maximum limits are deter-
mined by the classification test describe below which cor-
responds to a MSL classification level 6 to 1 according to
the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033.
ACPM-7331 is MSL3. Thus, according to the J-STD-033
p.11 the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature for
the ACPM-7331 is targeted at 260°C +0/-5°C. Figure 23
and Table 8 show typical SMT profile for maximum tem-
perature of 260 +0/-5°C.
CDM
Classification
Class 
Class 
Class 
Class 
Class 
Class 
Class 
Class 
Class 
Class 

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