ACPM-7381-OR1 Avago Technologies US Inc., ACPM-7381-OR1 Datasheet - Page 11
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ACPM-7381-OR1
Manufacturer Part Number
ACPM-7381-OR1
Description
IC PA MOD UMTS2100 WCDMA 10-SMD
Manufacturer
Avago Technologies US Inc.
Type
High Speed Optocouplerr
Datasheet
1.ACPM-7381-TR1.pdf
(18 pages)
Specifications of ACPM-7381-OR1
Current - Supply
465mA
Frequency
1.92GHz ~ 1.98GHz
Gain
27dB
Package / Case
10-SMD Module
Rf Type
W-CDMA, HSPDA
Voltage - Supply
3.2V ~ 4.2V
Operating Frequency
1980 MHz
Supply Current
500 mA
Maximum Operating Temperature
+ 90 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 20 C
Number Of Channels
1 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
P1db
-
Test Frequency
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ACPM-7381-OR1
Manufacturer:
NXP
Quantity:
3 490
Part Number:
ACPM-7381-OR1
Manufacturer:
AVAGO/安华高
Quantity:
20 000
PCB Design Guidelines
The recommended ACPM-7381 PCB land pattern is shown
in Figure 18 and Figure 19. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 20. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm(4mils)or 0.127mm(5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.85
Figure 18. Metallization
Figure 19. Solder Mask Opening
0.85
Figure 20. Solder Paste Stencil Aperture
0.85
0.5
0.4
0.4
0.25
0.6
0.7
0.6
2.4
0.1
2.0
on 0.6mm pitch
Ø 0.3mm
0.5
0.55
0.5
1.8
1.6