AF216M245001-T Taiyo Yuden, AF216M245001-T Datasheet - Page 7

• Manufacturer Part Number: AF216M245001-T
• Description: ANT BLUETOOTH W-LAN ZIGBEE WIMAX
• Manufacturer: Taiyo Yuden
• Series: AFr

Specifications of AF216M245001-T

• Antenna Type: Chip
• Number Of Bands: 1
• Frequency: 2.4GHz ~ 2.5GHz
• Vswr: 3
• Gain: 1.8dBi
• Termination: Surface Mount
• Mounting Type: Surface Mount
• Height (max): 0.06" (1.6mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-1727-2

11．When repairing by hand solder iron, temperature of soldering iron should be less than less than 320℃ for less
10．When supersonic washing is applied, please confirm cleaning condition in advance because crack may occur
2．Don’t apply excessive pressure and shock because these products are made from ceramics element.
1．Be careful of using these products because characteristics may be deteriorated when it is used in the
3．Don’t apply excessive pressure and shock to these products during transporting and handling of print circuit
4．Be careful of handling (Don’t fall and hit) because characteristics changes when electrode is damaged and
5．Please storage under the following condition
6．Arrange these products of position of mounting where stress isn't applied against sled and deflection of circuit
8．Please use flux containing less than 0.1% wt (cl conversion) of halogen material in soldering to prevent
9．Preheat in soldering so as to be less than 100℃ between solder temperature and products temperate to
Precautions
・Place where water splashes directly, dew condensation is ease to occur because of high humidity, direct
・Special gas atmosphere (Such as CI2, NH3, SOx and Nox, etc.)
・Gas atmosphere with volatility and flammability
・Place where dust is abundant
Temperature : Below +40 ℃
Humidity : Below 85% RH
than 3 seconds to prevent a terminal electrode decline.
following environment.
board that these products are soldered.
chipped out. And, don't touch these products with bare hands because it causes a solderability decline.
board.
Be careful not to apply stress and deflection of board during process after soldering these products (circuit
board cut, break board checker, mounting of other components, installation to chassis and wave soldering
to backside of the circuit board after Reflow soldering) because electrode peeling and chip break occur by
stress and deflection. When separating print circuit board after mounting, please 7．Be careful not to apply
excessive stress and shock to prevent break and chip out during mounting these products on print circuit
board.
corrosion of electrodes and decline of insulation resistance.
prevent break of these products.
in these products and the soldering part by vibration and strength of the terminal electrode may be declined.
Use these products after the delivery within six months. And, after more than six months have passed,
confirm solderability before the use them.
sunlight is subjected and freeze.
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