EM35X-DEV-IAR Ember, EM35X-DEV-IAR Datasheet - Page 227
EM35X-DEV-IAR
Manufacturer Part Number
EM35X-DEV-IAR
Description
KIT DEV EM35X IAR EWARM ZIGBEE
Manufacturer
Ember
Series
EM35xr
Type
Zigbeer
Specifications of EM35X-DEV-IAR
Frequency
2.4GHz
For Use With/related Products
EM351, EM357
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
636-1027
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19 Mechanical Details
19.1 QFN48 Footprint Recommendations
The EM35x package is a plastic 48-pin QFN that is 7 mm x 7 mm x 0.90 mm. Figure 19-1 illustrates the package
drawing.
Figure 19-2 demonstrates the IPC-7351 recommended PCB Footprint for the EM35x (QFN50P700X700X90-49N).
A ground pad in the bottom center of the package forms a 49
A 3 x 3 array of non-thermal vias should connect the EM35x decal center shown in Figure 19-2 to the PCB
ground plane through the ground pad. In order to properly solder the EM35x to the footprint, the Paste Mask
layer should have a 3 x 3 array of circular openings at 1.015 mm diameter spaced approximately 1.625 mm
(center to center) apart, as shown in Figure 19-3. This will cause an evenly distributed solder flow and
coplanar attachment to the PCB. The solder mask layer (illustrated in Figure 19-4) should be the same as the
copper layer for the EM35x footprint.
For more information on the package footprint, please refer to the appropriate EM35x Reference Design.
Figure 19-1. Package Drawing
Final
19-1
th
pin.
EM351 / EM357
120-035X-000G
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