EM250-DEV Ember, EM250-DEV Datasheet - Page 109
EM250-DEV
Manufacturer Part Number
EM250-DEV
Description
KIT DEV FOR EM250
Manufacturer
Ember
Series
InSightr
Type
802.15.4/Zigbeer
Specifications of EM250-DEV
Frequency
2.4GHz
For Use With/related Products
EM250
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
636-1002
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8 Mechanical Details
2x
2x
Nx
The EM250 package is a plastic 48-pin QFN that is 7mm x 7mm x 0.9mm. A large ground pad in the bottom
center of the package forms a 49
PCB ground plane. For more information, refer to the EM250 Reference Design.
Figure 17 illustrates the package drawing.
Detail B
Top View
Edge View
D
4
Detail B
E
E1 E2
Figure 17. Package Drawing
0.4000
0.4000
th
pin. A number of thermal vias should connect the EM250 decal center to a
R
0.15 typ
nx b
Bottom View
L1
Detail A
D2
D1
e
7
6
Detail A
EXPOSED
PAD
Pin 1
3
Notes
1. JEDEC ref MO-220
2. All dimensions are in millimeters
3. Pin 1 orientation identified by chamfer on corner of
exposed die pad .
4. Datum C and the seating plane are defined by the flat surface
of the metallised terminal
5. Dimension 'e' represents the terminal pitch
6. Dimension b applies to metallised terminal and is measured
0.25 to 0.30mm from terminal tip.
7. Dimension L1 represents terminal pull back from package
edge . Where terminal pull back exists , only upper half of lead is
visible on package edge due to half etching of leadframe
8. Package surface shall be matte finish
9. Package warp shall be 0.050 maximum
10. Leadframe material is copper A 194.
11. Coplanarity applies to the exposed pad as well as the
terminals .
Sym.
A1
A3
D1
D2
E1
E2
L1
A
D
E
N
R
T
L
b
e
k
Common Dimensions (mm)
Sym.
Minimum
b min / 2
aaa
bbb
ccc
0.85
6.90
5.20
6.90
5.20
0.35
0.18
0.2
0
Form & P osit ion
Toleranc es f or
0. 15
0.10
0.10
Nominal
0.20 ref
0.90
0.02
7.00
5.30
7.00
5.30
0.40
0.23
0.50
0.15
5.5
5.5
48
Notes
Maximum
0.05
7.10
5.40
7.10
5.40
0.45
0.30
1.0
0.1
, Ra 1.6 - 2.2
120-0082-000I
.
EM250
109
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