STEVAL-TDR003V1 STMicroelectronics, STEVAL-TDR003V1 Datasheet - Page 16

• Manufacturer Part Number: STEVAL-TDR003V1
• Description: BOARD EVAL AB-54003L-512
• Manufacturer: STMicroelectronics
• Type: Amplifierr

Specifications of STEVAL-TDR003V1

• Design Resources: STEVAL-TDR003V1 Schematic STEVAL-TDR003V1 Bill of Materials
• Frequency: 135MHz ~ 175MHz
• For Use With/related Products: AB-54003L-512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-6457

Package mechanical data
6.2
16/20
Thermal pad and via design - SOT-89
Thermal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address the thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on through-hole vias with 0.203 mm to 0.330 mm finished hole size
on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in
a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve
similar results.
Figure 21. Pad layout details
STEVAL-TDR003V1