SA58640DK,112 NXP Semiconductors, SA58640DK,112 Datasheet

IC MIXER FM IF SYSTEM 20SSOP

SA58640DK,112

Manufacturer Part Number
SA58640DK,112
Description
IC MIXER FM IF SYSTEM 20SSOP
Manufacturer
NXP Semiconductors
Series
SA58640r
Datasheets

Specifications of SA58640DK,112

Package / Case
20-SSOP
Current - Supply
6mA
Voltage - Supply
4.5 V ~ 6 V
Frequency
150MHz
Rf Type
Cordless Phones
Gain
17dB
Noise Figure
7dB
Secondary Attributes
Up Converter
Number Of Mixers
2
Maximum Input Frequency
100 MHz
Mounting Style
SMD/SMT
Maximum Power Gain
17 dB
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935277002112::SA58640DK::SA58640DK
1. Introduction
2. General description
3. Features and benefits
4. Applications
The SA58640 was designed for cordless telephone applications in which efficient and
economic integrated solutions are required and yet high performance is desirable.
Although the product is not targeted to meet the stringent specifications of high
performance cellular equipment, it will exceed the needs for analog cordless phones. The
minimal amount of external components and absence of any external adjustments makes
for a very economical solution.
The SA58640 is a low-voltage monolithic FM IF system incorporating a mixer/oscillator,
two limiting intermediate frequency amplifiers, quadrature detector, logarithmic RSSI,
voltage regulator and audio and RSSI operational amplifiers. The SA58640 is available in
a 20-pin SSOP package.
SA58640
Low-voltage mixer FM IF system
Rev. 3 — 12 April 2011
Low power consumption: 5.0 mA typical at 5 V
Mixer input to >100 MHz
Mixer conversion power gain of 17 dB at 45 MHz
Crystal oscillator effective to 100 MHz (LC oscillator or external oscillator can be used
at higher frequencies)
102 dB of IF amplifier/limiter gain
2 MHz IF amplifier/limiter small signal bandwidth
Temperature compensated logarithmic RSSI with a 70 dB dynamic range
Low external component count; suitable for crystal/ceramic/LC filters
Audio output internal op amp
RSSI output internal op amp
Internal op amps with rail-to-rail outputs
ESD protection: Human body model 2 kV; robot model 200 V
Cordless telephones
Product data sheet

Related parts for SA58640DK,112

SA58640DK,112 Summary of contents

Page 1

SA58640 Low-voltage mixer FM IF system Rev. 3 — 12 April 2011 1. Introduction The SA58640 was designed for cordless telephone applications in which efficient and economic integrated solutions are required and yet high performance is desirable. Although the product ...

Page 2

... NXP Semiconductors 5. Ordering information Table 1. Ordering information Type number Package Name SA58640DK SSOP20 6. Block diagram Fig 1. SA58640 Product data sheet Description plastic shrink small outline package; 20 leads; body width 4.4 mm MIXER_OUT IF_AMP_IN IF_AMP_DEC IF_AMP_DEC amp mixer RSSI OSCILLATOR RF_IN_P OSCOUT RSSI_OUT ...

Page 3

... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 2. Symbol RF_IN_P RF_IN_N_DEC OSCOUT OSCIN RSSI_OUT V CC AUDIO_FB AUDIO_OUT RSSI_FB QUAD_IN LIM_OUT LIM_DEC LIM_DEC LIM_IN GND IF_AMP_OUT IF_AMP_DEC IF_AMP_IN IF_AMP_DEC MIXER_OUT SA58640 Product data sheet RF_IN_P 1 RF_IN_N_DEC 2 3 OSCOUT 4 OSCIN ...

Page 4

... NXP Semiconductors 8. Functional description The SA58640 signal processing system suitable for second IF systems with input frequency as high as 100 MHz. The bandwidth of the IF amplifier and limiter is at least 2 MHz with gain. The gain/bandwidth distribution is optimized for 455 kHz, 1.5 kΩ source applications. The overall system is well-suited to battery operation as well as and high quality products of all types ...

Page 5

... NXP Semiconductors 9. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg T amb Z th 10. Static characteristics Table amb Symbol [1] RF frequency = 45 MHz; +14.5 dBV RF input step-up; IF frequency = 455 kHz; R17 = 2.4 kΩ and R18 = 3.3 kΩ; RF level = −45 dBm; FM modulation = 1 kHz with ± 5 kHz peak deviation. Audio output with de-emphasis filter and C-message weighted filter ...

Page 6

... NXP Semiconductors 11. Dynamic characteristics Table 5. Dynamic characteristics Symbol Parameter Mixer/oscillator section (external LO = 220 mV RMS value) f input frequency i f oscillator frequency osc NF noise figure IP3 input third-order intercept I point G conversion power gain p(conv input resistance i(RF input capacitance i(RF) R mixer output resistance ...

Page 7

... NXP Semiconductors 12. Performance curves (mA −55 −35 − Fig 3. Supply current versus ambient temperature 5 (1) relative level (dB) −5 −15 −25 −35 (2) −45 (3) −55 (4) −65 −125 −105 − MHz; deviation = ±5 kHz 117.6 mV. o(aud)RMS (1) Audio. (2) AM rejection. (3) THD+N. (4) Noise. Fig 5. Relative level of audio, AM rejection, THD+N ...

Page 8

... NXP Semiconductors Fig 7. 13. Application information MHz input The layout is very critical in the performance of the receiver. We highly recommend our demo board layout. All of the inductors, the quad tank, and their shield must be grounded μ μF or higher value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this capacitor will ensure consistent good sensitivity in production. A 0.1 μ ...

Page 9

... NXP Semiconductors Table 6. Component C10 C12 C14 C15 C17 C18 C19 C21 C23 C26 C27 [2] FL1 [2] FL2 IFT1 [3] R5 R10 R11 R17 R18 R19 [1] This value can be reduced when a battery is the power source. [2] This kHz bandwidth 455 kHz ceramic filter. All the characterization and testing are done with this wideband filter ...

Page 10

... NXP Semiconductors AUDIO Fig 9. SA58640 Product data sheet SA6x6DK SA58640DK L1 C6 TOKO R11 44.545 MHz X1 R10 RSSI C27 C10 C9 VCC C12 GND 820 Ω 4.7 nF AUDIO_DC SA6x6DK/SA58640DK top view with components All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 April 2011 ...

Page 11

... NXP Semiconductors Fig 10. SA6x6DK/SA58640DK bottom view (viewed from top) SA58640 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 April 2011 SA58640 Low-voltage mixer FM IF system 001aal892 © NXP B.V. 2011. All rights reserved ...

Page 12

... NXP Semiconductors 14. Test information (1) Set your RF generator at 45.000 MHz, use a 1 kHz modulation frequency and a 6 kHz deviation if (2) The measured typical sensitivity for 12 dB SINAD should be 0.45 μV or −114 dBm at the RF input. (3) The smallest RSSI voltage (i.e., when no RF input is present and the input is terminated (4) The C-message and de-emphasis filter combination has a peak gain for accurate Fig 11 ...

Page 13

... NXP Semiconductors 15. Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.4 mm 1.5 0.25 0 1.2 Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION IEC SOT266-1 Fig 12 ...

Page 14

... NXP Semiconductors 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...

Page 15

... NXP Semiconductors 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...

Page 16

... NXP Semiconductors Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 9. Acronym AC AM ESD ESR NPO RF RSSI SINAD THD SA58640 Product data sheet maximum peak temperature ...

Page 17

... NXP Semiconductors 18. Revision history Table 10. Revision history Document ID Release date SA58540 v.3 20110412 • Modifications: Table 6 “Demo board application component SA58540 v.2 20110211 SA58640 v.1 20050406 SA58640 Product data sheet Data sheet status Change notice Product data sheet - list”: Product data sheet ...

Page 18

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 19

... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 20

... NXP Semiconductors 21. Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 General description . . . . . . . . . . . . . . . . . . . . . . 1 3 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 4 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 4 9 Limiting values Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Performance curves . . . . . . . . . . . . . . . . . . . . . 7 13 Application information ...

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