SI4311-B10-GM Silicon Laboratories Inc, SI4311-B10-GM Datasheet - Page 18

• Manufacturer Part Number: SI4311-B10-GM
• Description: IC RX FSK 315/434MHZ 20VQFN
• Manufacturer: Silicon Laboratories Inc
• Series: EZRadio®r
• Type: ISM Receiverr

Specifications of SI4311-B10-GM

• Package / Case: 20-VQFN
• Frequency: 315MHz, 434MHz
• Sensitivity: -104dBm
• Data Rate - Maximum: 10 kBaud
• Modulation Or Protocol: FSK
• Applications: Garage Openers, RKE, Security Alarms
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Operating Frequency: 315 MHz to 434 MHz
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 95 C
• Minimum Operating Temperature: - 45 C
• Mounting Style: SMD/SMT
• Supply Current: 20 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Memory Size: -
• Current - Receiving: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1976-5

Si 4311
18
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Symbol
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing is per the ANSI Y14.5M-1994 specification.
3. This land pattern design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
5. All metal pads are to be non-solder-mask-defined (NSMD). Clearance between the
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
GD
D2
E2
D
E
e
f
Condition (LMC) is calculated based on a fabrication allowance of 0.05 mm.
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
be used to assure good solder paste release.
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component standoff.
for small body components.
1.60
1.60
2.10
Min
Table 13. PCB Land Pattern Dimensions
Millimeters
2.71 REF
0.50 BSC
2.71 REF
2.53 BSC
Max
1.80
1.80
—
Rev. 0.5
Symbol
GE
ZD
ZE
W
X
Y
2.10
Min
—
—
—
—
Millimeters
0.61 REF
Max
0.34
0.28
3.31
3.31
—