TEF6862HL/V1S,557 NXP Semiconductors, TEF6862HL/V1S,557 Datasheet - Page 62

• Manufacturer Part Number: TEF6862HL/V1S,557
• Description: IC TUNER CREST SELECTIVE 64LQFP
• Manufacturer: NXP Semiconductors

Specifications of TEF6862HL/V1S,557

• Modulation Or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 101.9mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Frequency: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935288821557

Philips Semiconductors
18. Abbreviations
TEF6862_1
Product data sheet
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 63.
Acronym
AF
AFU
AGC
DAA
DX
IC
IF
JFET
LO
MPX
LW
MW
PLL
POR
RDS
RF
RSSI
SW
VCO
WB
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Alternative Frequency
Alternative Frequency Updating
Automatic Gain Control
Digital Auto Alignment
Distance
Integrated Circuit
Intermediate Frequency
Junction Field Effect Transistor
Local Oscillator
Multiplex
Long Wave
Medium Wave
Phase-Locked Loop
Power-On Reset
Radio Data System
Radio Frequency
Radio Signal Strength Information
Short Wave
Voltage-Controlled Oscillator
Weather Band
Rev. 01 — 14 September 2006
10 C measured in the atmosphere of the reflow oven. The package
Car Radio Enhanced Selectivity Tuner (CREST)
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TEF6862
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