TEF6730HW/V1,518 NXP Semiconductors, TEF6730HW/V1,518 Datasheet - Page 52

• Manufacturer Part Number: TEF6730HW/V1,518
• Description: IC DIGITAL IF FRONT END 64HTQFP
• Manufacturer: NXP Semiconductors

Specifications of TEF6730HW/V1,518

• Package / Case: 64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
• Modulation Or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 85.3mA, 114.7mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Bus Type: I2C
• Maximum Agc: 14 dB
• Maximum Frequency: 288 MHz, 108 MHz
• Minimum Frequency: 144 MHz, 65 MHz
• Modulation Technique: AM, FM
• Mounting Style: SMD/SMT
• Function: Radio
• Noise Figure: 12.9 dB, 6.9 dB
• Operating Supply Voltage: 8.5 V
• Supply Voltage (min): 8 V
• Supply Voltage (max): 9 V
• Minimum Operating Temperature: - 40 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Frequency: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 935278526518; TEF6730HW/V1-T; TEF6730HW/V1-T

Philips Semiconductors
TEF6730_1
Product data sheet
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These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 01 — 10 July 2006
10 C measured in the atmosphere of the reflow oven. The package
Front-end for digital-IF car radio
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TEF6730
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